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Finite element simulation of the effect of electric boundary conditions on the spherical indentation of transversely isotropic p

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Finite element simulation was used to analyze the effect of electric boundary conditions on the

indentation deformation of a transversely isotropic piezoelectric film with the contact radius

much larger than the film thickness. Six different combinations of electric boundary

conditions were used. The simulation results showed that the indentation load is proportional

to the square of the indentation depth and the indentation-induced electric potential at the

Finite Element Analysis of the Indentation-Induced Delamination of Bi-Layer Structures

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University of Southern California

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Sun, 29 Jul 2012 00:05:58

Contact deformation can cause local damage of mechanical structures and lead to structural failure

of mechanical devices. In this work, we use the finite element method to analyze the indentation-

induced delamination of a film-substrate structure and the critical tensile stress as the criterion to

determine local delamination on the interface between the film and the substrate. The simulation

Finite element analysis of the spherical indentation of transversely isotropic piezoelectric materials

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Finite element analysis was used to analyze the indentation deformation of

a transversely isotropic piezoelectric material (PZT-4) by a rigid spherical

indenter. Three cases were considered in the analysis, which included (a)

the indentation by an insulating indenter, (b) the indentation by a conducting

indenter and (c) the indentation of the piezoelectric material with equal electric

potential on the top surface. The indentation load was found to be proportional

The effect of an electric current on the nanoindentation behavior of tin

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Electrical–thermal–mechanical interactions determine the reliability and performance of microelectromechanical devices and systems.

Using the nanoindentation technique the effect of an electric current on the indentation deformation of Sn strips was studied for an

indentation load in the range 50–200 lN. During the indentation an electric current density in the range 993.05–4087.89 A cm2

was

passed through the Sn strips, which introduced electrical–thermal–mechanical interactions. The experimental results showed that the

Finite-Element Analysis of Current-Induced Thermal Stress n a Conducting Sphere

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Understanding the electrothermal-mechanical behavior of electronic inter-

connects is of practical importance in improving the structural reliability of

electronic devices. In this work, we use the finite-element method to analyze

the Joule-heating-induced thermomechanical deformation of a metallic sphere

that is sandwiched between two rigid plates. The deformation behavior of the

sphere is elastic–perfectly plastic with Young’s modulus and yield stress

decreasing with temperature. The mechanical stresses created by Joule