Dear Colleagues,
We would like to invite you to submit abstracts and attend the minisymposium titled "6.9 Adhesion, Friction, and Fracture at Soft Interfaces: Theory, Simulation, and Experiment" in the 2024 SES Annual Techinical Meeting, August 20-23, 2024, InterContinental Hangzhou, China. https://www.2024ses.com/
Abstract submissions are due Monday, April 1, 2024.
6.9 Adhesion, Friction, and Fracture at Soft Interfaces: Theory, Simulation, and Experiment
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