I'm programming a finite element program to analyze the force of submarine pipeline.When the pipeline is lifted highly from seabed，it is a large deformation problem.
Is there any open soure to solve the problem?
Give me some advices.
Thanks a lot!
Professor Yonggang Huang is selected to receive the 2010 Charles Russ Richards Memorial Award.
Hi
I want to impose SS-F-SS-F or F-F-F-F for boundary condition of rectangular plate with element free galerkin method and with
ortogonal transform method(G.R Liu and chen 2001) for imposing B.c.
How can I do that?
for F-F-F-F how can I impose B.c? when I do nothing for imposing B.c ,I will have 3 extra natural frequency
the first complex and second and third near zero. how can I solve this problem
thanks
vielen dank
Ali
Would like to hear your expertise/user/non-expert/sceptic comments on XFEM. Here are some of the challenges. Would like to hear your relections.
1. Can XFEM be utilized in characterizing Failure rather than Fracture?
2. What sort of challenges XFEM still have with respect to Fracture Mechanics?
3. How the Fracture mechanics benefit the industry, from the perspective of strcutural integrity?
4. Failue investigations vs. Fracture investigations: benefit to industry?
5. Academist vs Engineer: Perspective on XFEM
The Idaho National Laboratory has an opening for a Postdoctoral Appointee in the area of laser-based characterization of mechanical and thermal properties. This position is co-sponsored by the Fuel Cycle Research and Development program and the Center for Materials Science of Nuclear Fuel. The candidate must have completed a PhD degree in Materials Science, Physics, Mechanical engineering or a related field. The candidate should have a strong background in the development of continuum based models and/or a strong background in optics. The main objective of this proje
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement, using a profilometer, has become vitally important to warpage characterization and planarity measurement.
Hi ... what is the difference in functionality between charpy (a simply supported specimen(notched/unnotched) is hit by a swinging pendulum)and gardner test (a simply supported specimen(notched/unnotched) is hit by a vertical free falling mass guided by rails) ....
1.What is the loading pattern in the point of contact between the specimen and the setup?
2.Why fracture pattern varies between the two test setups for similar specimen with same impact velocity, Which parameter is responsible for the variation in fracture type.
