We have an opening for a postdoctoral scholar in the area of computational mechanics. Specific problems of interest include molecular dynamics and meshless method for continuum damage mechanics. Rich experience of C++, X-windows image processing, and Fortran programming (especially parallel processing) is required. Contact: Professor Jung-Wuk Hong at Michigan State University. Email: jwh at egr dot msu dot edu.
Hi,
I am just going to modify the existing failure criteria of cohesive element in ABA or even write new ones. I am wondering if it will be via UMAT or UEL, or other subroutines. Many thanks!
Chris
The 20th International Workshop on Computational Mechanics of Materials (IWCMM 2010) will be held on 8-10 September 2010 at Loughborough University, UK. Selected papers will be published in a Special Issue of Computational Materials Science by Elsevier.
For details see iwcmm.lboro.ac.uk .
Topics:
Any one can tell about the modelling of viscoelastic materials in ANSYS. In the modeeling how material properties can be given. Like I have material data in the form of Prony series parameter. If sone is having relaxation data how can that be fed to ANSYS model?
TIA
RKPATEL
i what matlab programing for modeling of conventional turning forces (fx,fy,fz) predictions
How does sand flow? A surprisingly difficult question. This entry tells the story behind a model detailed in [6] for dry, dense, steady-flowing granular materials.
ICEM 14 - International Conference on Experimental Mechanics
Poitiers, France, 4 - 9 July 2010
Abstracts are invited for the Smart Materials and Systems Mini Symposium (A9). We will welcome works related to smart materials and multifunctional nanocomposites and nanostructures characterisation and testing. More information can be found at the Conference website: http://www.icem14.fr
Hello all
plese if any one have informations about the crack propagation, using ansys package
hows we can using ansys to simulate th crack prpoagation with time.
i have aprobem
wait for u
The workshop will provide a forum for presenting current research and
for discussions on issues related to stress-induced phenomena in
on-chip metal interconnects and solder joints. Stresses arising in
metal structures and surrounding dielectric materials due to novel
process steps, thermal mismatch of thin film materials,
