Blog posts

Yesterday I had the distinct pleasure of seeing a mechanics seminar delivered "tag-team" by Ken Johnson and Jim Greenwood. (I know several people have thought I was a bit mad for jumping "across the pond" but there are really some amazing benefits of being part of the Cambridge Engineering faculty!)

Introduction

The blogosphere is abuzz with the latest report of the generalisation of the von Neumann-Mullins grain growth relation to 3 (and N) dimensions by MacPherson and Srolovitz (As an interesting aside, almost all the reports say mathematical structure of beer foam structure resolved, or words to that effect --hence, I also decided to join the bandwagon on that one). I heard Prof. Srolovitz describe the work in a seminar nearly six months ago. Based on my notes of the talk, I would like the explain their work in this post. Curvature in the following refers to mean curvature (and not Gaussian).

We have recently reported the piezoelectric thick film microcantilever, which enables the in-situ real-time detection of the protein related to disease (e.g. C reactive protein) in liquid environment. This work was published at APL (click here).

"In-situ real-time monitoring of biomolecular interactions based on resonating microcantilevers immersed in a viscous fluid"

JOM is a monthly publication of TMS--The minerals, metals, and materials society. It covers a wide range of materials topics. I expecially like the overview articles, which, in four or five pages pack lots of information. Further, the historical articles about metallurgy and materials in ancient civilizations will interest those of you who like to read about history in general, and science history, in particular.

In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on many interfaces on several levels of structures, in various length scales from tens of nanometers to hundreds of micrometers. A major challenge to model flip-chip packages is the huge variation of length scales, the complexity of microstructures, and diverse materials properties. In this paper, we simplify the structure to be silicon/substrate with wedge configuration, and neglect the small local features of integrated circuits. This macroscopic analysis on package level is generic with whatever small local features, as long as the physical processes of interest occur in the region where the concentrated stress field due to chip-packaging interaction dominates. Because it is the same driving force that motivates all of the flaws. Therefore, the different interface cracks with same size and same orientation but on different interfaces should have similar energy release rates provided that the cracks are much smaller than the macroscopic length. We calculate the energy release rate and the mode angle of crack on the chip-package interface based on the asymptotic linear elastic stress field. In a large range of crack length, the asymptotic solution agrees with finite element calculation very well. We discuss the simplified model and results in context of real applications. In addition, we find that the relation of energy release rate G and crack length a is not power-law since local mode mixity is dependent of crack length a. Therefore, the curve of G~a can be wavy and hardly goes to zero even if crack length a goes to atomically small. The local mode mixity plays an important role in crack behavior.