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Symposium on Fatigue and Fracture of Thin Films and Nanomaterials at TMS 2013 Annual Meeting, March 3-7, San Antonio, TX

Dan Gianola's picture

Dear Colleagues,

We would like to bring your attention to Fatigue and Fracture of Thin Films and Nanomaterials for the 2013 TMS Annual Meeting and Exhibition , taking place in San Antonio, Texas, USA, March 3rd -7th 2013. The aim of this planned three day symposium (six sessions) is to discuss recent developments in the area of fatigue and fracture of small volumes but also new in-situ characterization techniques that are in development to probe electrical, shape memory, and environmental behavior.

Abstracts may be submitted via the conference website and by selecting the symposium name above.  Please note the July 15 deadline for abstract submission

Scope This symposium will focus on recent developments in the fields of fatigue and fracture of thin films and small volumes, focusing on the governing mechanisms for improved properties and advanced testing technologies for characterization of mechanical, electrical, thermal and magnetic behavior at the nanoscale. With the wide variety of applications (protective coatings, semiconductors, flexible electronics) and the required control of mechanical, electrical, thermal and magnetic properties, a better understanding of the relationship between processing, microstructures, properties, and degradation mechanisms is needed to create more robust and reliable devices and structures for use in all environments. Thin film and small volume mechanical behavior has been explored for many years using several different in-situ and ex-situ techniques (nanoindentation, TEM, SEM, micro-XRD, etc), however, the need for new or improved testing techniques for the coupled measurement of electrical, magnetic, or shape memory properties under stress are also of interest - for example, changes in resistance due to microcracking or materials degradation. Furthermore, the enhanced understanding of microstructures that influence fatigue and fracture in thin films and nanomaterials is of interest. The combination of advanced testing techniques will improve the knowledge related to fatigue and fracture of thin films and small volumes.

In particular, a goal of this symposium is to accelerate the development and acceptance of new concepts and methodologies in understanding the role that microstructure and processing exert on the coupled mechanical, electrical and magnetic behavior of materials for flexible electronics, thin films and nanostructured materials.

The subject areas of the symposium include, but are not limited to:
• Mechanical and thermal fatigue of thin films and small volumes
• Fracture of nanostructured materials (thin films, metals, ceramics and biomimetic materials)
• Developments in flexible electronic materials systems and nanomaterials for energy harvesting or storage applications
• Magnetic and shape memory properties of thin films and small volumes
• New developments in testing techniques using coupled in-situ measurements (electrical, optical, mechanical, etc.) or in enhanced environments (high temperatures, humidity controlled, etc.)

We hope to see you in San Antonio next spring.  

Sincerely,

Dan Gianola

Megan Cordill

Daniel Kiener

Corinne Packard

Xinghang Zhang 

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