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ECCM IV, 2010, Paris: Symposium on multiscale methods for modelling surface effects on nanosystems and nanostructured materials

Julien Yvonnet's picture

We are inviting abstracts for the following symposium: Multiscale methods for modeling surface effects on nanosystems and nanostructured materials, European Conference on Computational Mechanics (ECCM IV), May 16-21, 2010, Paris, France.
http://ww/eccm2010.org/index.php
Abstract submission deadline: November 20, 2009.Description

A large number of unique effects related to surface and interfaces occur in structures or materials with nanometer dimensions, leading to very different physical properties (mechanical, thermal, optical, magnetic, electronic…) as compared with bulk, or macroscale structures. This minisymposium will focus on the development and application of computational methods for the modelling of these surface/interface effects on the behavior and properties of nanoscale materials.  Studies that identify the relevant surface physics and their effects on nanostructures such as nanowires, nanotubes, graphene, nanoparticles, quantum dots, coatings and thin films of metals, semiconductors, polymers and ionic materials are of interest.
The topics covered by this symposium include (but not limited to):

 ·       Atomistic (ab initio and classical MD) and continuum simulations of size and surface effects on the elastic and inelastic behavior and properties of nanostructures, i.e. deformation and fracture, size-dependent elastic properties, energy dissipation.

·       Novel and innovative numerical methods for multiscale analysis of nanosystem that couple nanoscale surface effects with their impact on continuum-level properties

·       Multiphysics modelling of surface effects on nanosystems (piezoelectricity, flexoelectricity,  thermomechanical couplings, optical and magnetic effects…)

·       Self assembly of nanostructures such as quantum dots, or nanostructure growth, adhesion in nanosystems,  

Minisymposium Organizers

Julien YVONNET (Université Paris-Est, France), julien.yvonnet@univ-paris-est.fr

Vincent B.C. TAN (National University of Singapore, Singapore), mpetanbc@nus.edu.sg

Harold S. PARK (University of Colorado, USA), harold.park@colorado.edu 

Registration Information:

http://www.eccm2010.org/index.php

 

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