Dear colleagues,
The Society of Engineering Science (SES) 57th Annual Technical Meeting will be held at Hyatt Regency Minneapolis, September 28-30, 2020 (https://ccaps.umn.edu/SES).
As part of this meeting, we are organizing a mini-symposium addressing the advances in polymer modeling and simulations under Track 7 - Soft, Active Materials and Applications in Soft Robotics.
We are excited by organizing a mini-symposium on 3D Micro/Nano-Architectures Based On Low-Dimensional Materials at the coming Society of Engineering Science (SES) 57th Annual Technical Meeting. More details about the mini-symposium are given below. We are posting this announcement to welcome submitting relevant abstracts to our mini-symposium. The submission is now open and more information on abstract submissions can be found on 2020 SES website with a submission deadline of March 17, 2020. Thank you for your contribution and I am looking forward to seeing you at 2020 SES at Minneapolis.
Dear colleagues:
We would like to invite you to submit an abstract to the symposium on “3D/4D printing and advanced manufacturing of materials and structures” at the 2020 Society of Engineering Science meeting to be held from September 28 to September 30 at the University of Minnesota in Minneapolis, MN, USA.
