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finite element methods

Slow-Fast Crack Propagation in Ferroelectric Single Crystals

Submitted by Amir Abdollahi on

Dear Colleague,

 

I have uploaded a video which shows the simulation of Slow-Fast crack propagation in ferroelectric single crystals:

http://www.youtube.com/watch?v=6E7WSVOVAWM

 

For technical details, please refer to our recently published paper in Acta Materialia:

http://www.sciencedirect.com/science/article/pii/S1359645411001777

 

Best regards,

The indentation of pressurized elastic shells: from polymeric capsules to yeast cells - D.Vella, A.Ajdari, A.Vaziri & A.Boudaoud

Submitted by Amin Ajdari on

Pressurized elastic capsules arise at scales ranging from the 10 m diameter pressure vessels used to store propane at oil refineries to the microscopic polymeric capsules that may be used in drug delivery. Nature also makes extensive use of pressurized elastic capsules: plant cells, bacteria and fungi have stiff walls, which are subject to an internal turgor pressure. Here, we present theoretical, numerical and experimental investigations of the indentation of a linearly elastic shell subject to a constant internal pressure.

Phase-field simulation of anisotropic crack propagation in ferroelectric single crystals

Submitted by Amir Abdollahi on

This is the preprint of an article that will appear in Modelling and Simulation in Materials Science and Engineering (MSMSE)

Title: Phase-field simulation of anisotropic crack propagation in ferroelectric single crystals: effect of microstructure on the fracture process

Authors: Amir Abdollahi and Irene Arias, Universitat Politecnica de Catalunya (UPC), Barcelona

 

 

Abstract:

Open House: Can you define FEM in one line?

Submitted by Ajit R. Jadhav on

Can you define FEM in one line?

If yes, what would it be? And, in that case, permit me a second question: How?

 

...Really interested in knowing what the members of this community think (of this matter), if they do...

 

--Ajit

[E&OE]

 

SIMULIA announces new features in Abaqus 6.10

Submitted by Kewei Li on

For those of you looking for FSI simulation on Abaqus platform, recently Simulia has announced the new features in release 6.10, which introduces the capability for performing Computational Fluid Dynamics (CFD) simulation.
So it enables users to perform coupled physics simulations with
Abaqus/Standard and Abaqus/Explicit, such as fluid-structure
interaction between human tissue, a medical device, and fluid flow, more information:

http://www.simulia.com/news/pr_100524_DSS.html

 

On efficient finite element assembly in Matlab

Submitted by Alejandro Orti… on

As we all know, finite element matrices are sparse and many memory can be saved if their sparsity is exploited. Due to the latter, we are often provoked to declare the nxn stiffness matrix as a sparse one just before the element loop. Be careful of this method since the larger the matrix the slower the assembly operations. There is a better and more efficient way to code the assembly procedure in Matlab. I will show how to accomplish this. For the sake of simplicity, the stiffness matrix of the two-dimensional heat conduction problem on the domain (0,1)x(0,1) is considered.

Newton International Fellowships

Submitted by Lee Margetts on

"The Newton International Fellowship scheme will select the very best early stage post-doctoral researchers from all over the world, and offer support for two years at UK research institutions."

http://www.newtonfellowships.org

If you are interested in applying for a Newton Fellowship at the University of Manchester, meet the criteria specified on the url above, and have a background in:

Postdoctoral Research Associate Position in Computational Solid Mechanics at KAUST

Submitted by Dawei Zhang on

A postdoctoral position is avilable in the Composite and Heterogeneous Materials Modeling and Simulation (COHMAS) Laboratory at King Abdullah University of Science and Technology (KAUST). The successful candidate will be engaged in modeling and simulation of degradation in composite materials.

Singular stress fields at corners in flip-chip packages

Submitted by Nanshu Lu on

An electronic device integrates diverse materials, and inevitably contains sharp features, such as interfaces and corners. When the device is subject to thermal and mechanical loads, the corners develop intense stress and are vulnerable sites to initiate failure. This paper analyzes stress fields at corners in flip-chip packages. The stress at a corner is a linear superposition of two modes of singular fields, with one mode being more singular than the other. The amplitudes of the two modes are represented by two stress intensity factors of dissimilar dimensions.