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Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement, using a profilometer,  has become vitally important to warpage characterization and planarity measurement.