Warpage Measurement of PCB With 3D Profilometry

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement, using a profilometer,  has become vitally important to warpage characterization and planarity measurement. APPLICATION NOTE: http://www.nanovea.com/Application%20Notes/warpagemeasurement.pdf