User login


You are here

Warpage Measurement of PCB With 3D Profilometry

NANOVEA's picture

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement, using a profilometer,  has become vitally important to warpage characterization and planarity measurement. APPLICATION NOTE:

Subscribe to Comments for "Warpage Measurement of PCB With 3D Profilometry"

More comments


Subscribe to Syndicate