warpage

Warpage prediction of laminated composite materials

Submitted by Xi Liu on Mon, 09/17/2012 - 13:23

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Can anybody recommend some papers/books that discuss how to caculate thermal induced warpage of lamianted composite materials? Paper/books with detial caculation/derivation process are preferred. Thanks a lot!

Warpage Measurement of PCB With 3D Profilometry

Submitted by NANOVEA on Thu, 06/10/2010 - 17:38

Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can play a major role in PCB warpage and or planarity defects. As a result, accurate flatness measurement, using a profilometer, has become vitally important to warpage characterization and planarity measurement.

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