lecture

• Z. Suo and J. W. Hutchinson, "Interface crack between two elastic layers," Int. J. Fracture, 43, 1-18 (1990).
• Section III in J.W.

• Williams singularity
• Energy release rate
• Mode angle
• Stress oscillation
• Small scale contact
• Example 1:  A small crack on the interface
• Example 2:  Thin film debonding
• Interfacial fracture energy
• Four-point bend specimen
• Double-cantilever beam
• The use of the interfacial fracture energy

Dear Students of ES 242r / ENGM 940:

You may be interested in reading about the self-introductions of your fellow students. 

The attached notes are written mainly for myself. Most figures are missing. I'll draw these figures in class. So please take good notes in class.

Lecture 7.  Stability of large scale yielding crack growth & fracture mechanisms

• Various cracks in thin films under tensile or compressive stresses
• Micrographs of cracks in thin films
• A micrograph of a channel crack
• The origin of stress in a film
• Stress in a thin film due to mismatch in the coefficients of thermal expansion
• Stress in film due to bending
• Measure redisual stress using wafer curvature
• Channel crack:  initiation vs. steady propagation
• Steady-state energy release rate of a channel crack
• Channel crack in patterned structure

Lecture 5

Lecture 4

Lecture 3

fracture specimens and KIC

The slides for lecture 1 are attached.