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Swell induced surface instability of confined hydrogel layers

Submitted by Rui Huang on

A previous work suggested a critical condition to form surface creases in elastomers and gels. For elastomers, the critical condition seems to have closed a gap between experimental observations (e.g., by bending a rubber block) and the classical instability analysis by Biot. For gels, however, experiments have observed a wide range of critical swelling ratios, from around 2 to 3.7. Here we present a linear perturbation analysis for swollen hydrogels confined on a rigid substrate, which predicts critical swelling ratios in a similar range.

On the cover of the NSF 2011 Congressional Budget Request

Submitted by Teng Li on

The research on stretchable and twistable electronics by Yonggang Huang at Northwestern University and John A. Rogers at the University of Illinois at Urbana- Champaign has been featured on the cover of the NSF Budget Request to the United States Congress for the fiscal year 2011.

Details available at http://www.nsf.gov/about/budget/fy2011/cover_caption.jsp

The Most-Cited Institutions in Engineering, 1999-2009

Submitted by Jizhou Song on

ScienceWatch.com (affiliated with Thomson-Reuters), has ranked University of Illinois as the most cited institution in engineering from 1999 to 2009 (http://sciencewatch.com/inter/ins/10/10febTOP20ENG/).  It is followed by Berkeley, MIT, Stanford, University of Michigan, and Georgia Tech.

 

New idea in fatigue problems

Submitted by uni_students2009 on

there are two analytical concepts that are very important in fatigue failure.the first one is crack closure and the others is residual stress .the first one is in behind of crack and the other emphasis in the front of crack tip. the question is if we use some devices such as AFM/SEM is it possible we model the energy filed during fatigue process?   if this idea can be investigated the second question can be asked: is there any similarity to model for different loading conditions? 

 

I appreciate if you also put your comment in my idea?