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Call for proposals on advanced high strength steel

Submitted by Ken P. Chong on

The Division of Civil, Mechanical and Manufacturing Innovation (CMMI) of NSF and the DOE Office of Freedom CAR and Vehicle Technologies intend to co-sponsor proposals addressing fundamental research issues in advanced high strength steels (AHSS). Specifically, proposals focused on

  1. AHSS materials development and characterization,
  2. predictive modeling that integrates AHSS material structure and product performance, and
  3. fundamental research in the area of processing and manufacturing of AHSS, are of interest. This collaborative effort is a direct outcome of the Advanced High Strength Steel Workshop.

Interested PIs should consider submitting an unsolicited proposal to the core programs of the CMMI Division namely, (1) Materials Processing & Manufacturing (MPM), (2) Materials Design & Surface Engineering (MDSE), (3) Applications & Structural Mechanics, or (4) Mechanics & Structures of Materials (MSM), during the January 15, 2007 to February 15, 2007 submission window. Unsolicited proposals in response to this letter should have titles beginning with "AHSS:".  Proposals from the March-April 2007 panel review will be eligible for co-funding, pending availability of funds.

Journal Club Theme of January 2007: Biomechanics and Non-Affine Kinematics

Submitted by MichelleLOyen on
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Biological materials are frequently constructed of hydrated biopolymer networks. Examples include fibrous collagen in the extracellular matrix and actin within the cell's cytoskeleton. There are differences in the molecular composition of the biopolymer subunits as well as differences in the network density and organization. Images can be seen here and here for dense collagen networks and for portions of actin networks look at images here and here.

Call for papers: Micro/Meso Mechanical Manufacturing (M4 Process)

Submitted by Roddy MacLeod on

Call for papers: Micro/Meso Mechanical Manufacturing (M4 Process)

http://www.inderscience.com/browse/callpaper.php?callID=568

Call for papers: Micro/Meso Mechanical Manufacturing (M4 Process)

A special issue of the International Journal of Abrasive Technology (IJAT)

Call for papers: Computer Applications in Research and Development of Complex Mechanical Systems

Submitted by Roddy MacLeod on

http://www.inderscience.com/browse/callpaper.php?callID=579

Call for papers: Computer Applications in Research and Development of Complex Mechanical Systems

A special issue of the International Journal of Computer Applications in Technology  (IJCAT)

Nonlinear Electroelastic Deformations

Submitted by Luis Dorfmann on

Electro-sensitive (ES) elastomers form a class of smart materials whose mechanical properties can be changed rapidly by the application of an electric field. These materials have attracted considerable interest recently because of their potential for providing relatively cheap and light replacements for mechanical devices, such as actuators, and also for the development of artificial muscles. In this paper we are concerned with a theoretical framework for the analysis of boundary-value problems that underpin the applications of the associated electromechanical interactions. We confine attention to the static situation and first summarize the governing equations for a solid material capable of large electroelastic deformations. The general constitutive laws for the Cauchy stress tensor and the electric field vectors for an isotropic electroelastic material are developed in a compact form following recent work by the authors. The equations are then applied, in the case of an incompressible material, to the solution of a number of representative boundary-value problems. Specifically, we consider the influence of a radial electric field on the azimuthal shear response of a thick-walled circular cylindrical tube, the extension and inflation characteristics of the same tube under either a radial or an axial electric field (or both fields combined), and the effect of a radial field on the deformation of an internally pressurized spherical shell.

thermoPhoresis

Submitted by hossesf on
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Hi every body:

I'm searching for some one that can help me about the boundary conditions on the wall for a based fluid including nanoparticles. The most dominant phenomena is the thermophoresis effect, and also close to wall the Brownain effect seems be important.

Thanks/farid

Nonlinear elasticity of biological gels

Submitted by Kilho Eom on
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I would like to propose the recent papers by Janmey, P.A., and coworkers on the nonlinear elasticity behavior of biopolymer gels for "biomechanics" issue in J Club. In their original work, they proposed the biopolymer network model composed of semi-flexible polymers that behave like a worm-like-chain (WLC) model. Their models surprisingly capture the mechanical response of biopolymer gels such as neuro-filaments. The details of their work are as follows:

Delocalizing Strain in a Thin Metal Film on a Polymer Substrate

Submitted by Teng Li on

Teng Li, Zhenyu Huang, Zhichen Xi, Stephanie P. Lacour, Sigurd Wagner, Zhigang Suo, Mechanics of Materials, 37, 261-273 (2005).

Under tension, a freestanding thin metal film usually ruptures at a smaller strain than its bulk counterpart. Often this apparent brittleness does not result from cleavage, but from strain localization, such as necking. By volume conservation, necking causes local elongation. This elongation is much smaller than the film length, and adds little to the overall strain. The film ruptures when the overall strain just exceeds the necking initiation strain, εN , which for a weakly hardening film is not far beyond its elastic limit. Now consider a weakly hardening metal film on a steeply hardening polymer substrate. If the metal film is fully bonded to the polymer substrate, the substrate suppresses large local elongation in the film, so that the metal film may deform uniformly far beyond εN. If the metal film debonds from the substrate, however, the film becomes freestanding and ruptures at a smaller strain than the fully bonded film; the polymer substrate remains intact. We study strain delocalization in the metal film on the polymer substrate by analyzing incipient and large-amplitude nonuniform deformation, as well as debond-assisted necking. The theoretical considerations call for further experiments to clarify the rupture behavior of the metal-on-polymer laminates.

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High ductility of a metal film adherent on a polymer substrate

Submitted by Yong Xiang on

In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates, and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks, and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture.

Mechanics of flexible macroelectronics

Submitted by Teng Li on

The following entry was first posted in www.macroelectronics.org on 8 May 2006.

Flat-panel displays are rapidly replacing cathode-ray tubes as the monitors of choice for computers and televisions, a commercial success that has opened the era of macroelectronics, in which transistors and other micro-components are integrated over large areas. In addition to the flat-panel displays, other macroelectronic products include x-ray imagers, thin-film solar cells, and thin-film antennas.
Like a microelectronic product, a macroelectronic product consists of many thin-film components of small features. While microelectronics advances by miniaturizing features, macroelectronics does so by enlarging systems. Macroelectronic products today are mostly fabricated on substrates of glass or silicon; they are expensive, fragile and not readily portable when their areas are large. To reduce cost and enhance portability, future innovation will come from new choice of materials and of manufacturing processes. For example, thin-film devices on thin polymer substrates lend themselves to roll-to-roll fabrication, resulting in lightweight, rugged and flexible products. These macroelectronic products will have diverse architectures, hybrid materials, and small features. Their mechanical behavior during manufacturing and use poses significant challenges to the creation of the new technologies.

A recent review paper by Suo et al. describes ongoing work in the emerging field of research – mechanics of flexible macroelectronics, with emphasis on the mechanical behavior at the scale of individual features, and over a long time. The following topics have been discussed in the paper: