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Jie-Hua Zhao

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TypeTitleAuthorRepliesLast updated
Blog entryFEM Job Opportunity at Apple Jie-Hua Zhao01 year 1 month ago
Blog entryFEM Job Opportunity at Apple Jie-Hua Zhao21 year 1 month ago
Blog entryInter Opportunity at Apple Jie-Hua Zhao04 years 4 months ago
Blog entryIntern Opening at Apple Jie-Hua Zhao04 years 11 months ago
Blog entrySr. Packaging Mechanical Analyst at Apple Jie-Hua Zhao06 years 4 months ago
Blog entryIntern Opportunity at Apple Jie-Hua Zhao16 years 7 months ago
Blog entryViscoplastic OR elasto-viscoplastic simulation T.ZENG19 years 6 months ago
Blog entryMicrostructure-based Stress Modeling of Tin Whisker Growth Jie-Hua Zhao19 years 11 months ago
Forum topicJournal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond Rui Huang2310 years 7 months ago
Blog entryJournal Club for 15 June 2008: Kinetics of Structural Phase Transformations Kaushik Dayal810 years 10 months ago
Blog entryResearch Position at Texas Instruments (Dallas, Texas) Jie-Hua Zhao111 years 10 months ago
Blog entryMechanicians Meet Engineers: ITherm 2008 Call for Abstracts Jie-Hua Zhao011 years 11 months ago
Forum topicResearch Position at Texas Instruments (Dallas, Texas) Jie-Hua Zhao011 years 12 months ago
IBM Airgap Microprocessor Xiao Hu Liu1112 years 2 weeks ago
Blog entryDelamination in Patterned Films Xiao Hu Liu1812 years 1 month ago
Blog entryChannel cracks in a hermetic coating consisting of organic and inorganic layers Nicolas Cordero212 years 2 months ago
Blog entryA PROBABILISTIC MECHANICS APPROACH TO DIE CRACKING Jie-Hua Zhao012 years 8 months ago

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