Blog entry | Grant for master thesis at Bosch: FEM Simulation of Fracture in Electronic Components | shirangi | 1 | 11 years 8 months ago |
Blog entry | Virtual Testing of Structural Integrity in Microelectronic Assemblies | shirangi | 0 | 13 years 3 months ago |
Blog entry | Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface | shirangi | 4 | 15 years 4 months ago |
Blog entry | Mechanism of Moisture Diffusion and Adhesion Degradation in Epoxy Molding Compounds | shirangi | 1 | 15 years 8 months ago |
| ENF | shirangi | 0 | 15 years 8 months ago |
| Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface | shirangi | 0 | 15 years 8 months ago |
Blog entry | EuroSimE 2008 in Freiburg, Germany | shirangi | 0 | 16 years 4 months ago |
Blog entry | International conference in Microreliability and Nanoreliability, Berlin, Sep. 2007 | shirangi | 0 | 16 years 11 months ago |
Blog entry | Interfacial moisture diffusion using cohesive zone elements | shirangi | 8 | 16 years 11 months ago |
Blog entry | Chip-package interaction and interfacial delamination | Zhen Zhang | 9 | 17 years 1 month ago |
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