| Forum topic |
Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond |
Rui Huang |
4 weeks ago |
| Forum topic |
Texas Instruments will extend outsourcing model. Will more people lose jobs? |
Zhigang Suo |
4 weeks ago |
| Forum topic |
Analytical derivation on the stress of the adhesive layer based on beam/plate therories? |
Mingji Wang |
4 weeks ago |
| Blog entry |
A computational mechanics position in microelectronics industry |
charliezhai |
4 weeks ago |
| Blog entry |
Chip-package interaction and interfacial delamination |
Zhen Zhang |
4 weeks ago |
| Blog entry |
Delamination in Patterned Films |
Xiao Hu Liu |
4 weeks ago |
| Blog entry |
Delamination of stiff islands patterned on stretchable substrates |
Nanshu Lu |
18 years 8 months ago |