Prof. Yong Zhu at NCSU and myself are organizing MiniSymposium 328-Mechanics of Flexible, Stretchable and Bio-Integrated Electronics for the 19th U.S. National Congress on Theoretical and Applied Mechanics (USNC/TAM 2022), which will be held June 19-24, 2022 in Austin, TX. The new deadline for abstract submission is Jan. 31, 2022.
UT-Austin Engineering Mechanics Program is well known for its research on experimental mechanics, computational mechanics, fracture mechanics, nano- and micro-mechanics, thin-film mechanics, biomechanics, soft material mechanics, structural dynamics, and so on. We are the home of the International Journal of Solids and Structures (IJSS), International Journal of Fracture, and Computer Methods in Applied Mechanics and Engineering.
The Department of Aerospace Engineering and Engineering Mechanics at the University of Texas at Austin is ranked #8 best graduate program by US News. We currently have a tenure-track position in the area of Experimental Nano/Micro-Mechanics beginning Fall 2022. The deadline to apply is 12/01/2021. Please apply or spread the word for us.
Dear colleagues,
You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.
Dear Colleagues,
On behalf of the organizing committee, I cordially invite your participation in Symposium on Wrinkled and Crumpled Membranes, as part of the 13th Pan-American Congress of Applied Mechanics (PACAM XIII), to be held in Houston, Texas, May 22-24, 2013.
We perform uniaxial tensile tests on polyimide-supported copper films with a strong (111) fiber texture and with thicknesses varying from 50 nm to 1 μm. Films with thicknesses below 200 nm fail by intergranular fracture at elongations of only a few percent. Thicker films rupture by ductile transgranular fracture and local debonding from the substrate. The failure strain for transgranular fracture exhibits a maximum for film thicknesses around 500 nm.
An electronic device integrates diverse materials, and inevitably contains sharp features, such as interfaces and corners. When the device is subject to thermal and mechanical loads, the corners develop intense stress and are vulnerable sites to initiate failure. This paper analyzes stress fields at corners in flip-chip packages. The stress at a corner is a linear superposition of two modes of singular fields, with one mode being more singular than the other. The amplitudes of the two modes are represented by two stress intensity factors of dissimilar dimensions.
