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Nanshu Lu's blog

ES 240 (Fall 2007) Lecture Notes - Elements of Elasticity

Submitted by Nanshu Lu on

The lecture notes are prepared by Prof. Joost Vlassak based on a set of course notes put together by Prof. Suo when he taught ES 240 in 2006, as well as on course notes developed by Prof. Vlassak for ES 246.

Please see attached. 

NSF Mini Travel Grants - 10th Pan American Congress Appl. Mech

Submitted by Nanshu Lu on

The National Science Foundation (NSF) has made a recent award to help increase graduate student participation at the Tenth Pan American Congress of Applied Mechanics (PACAM X).  These awards will be made in the form of mini-travel grants ($500 - $1,000) for exceptionally qualified students to participate in PACAM X January 7-11, 2008, in beautiful Cancun, Mexico.

Delamination of stiff islands patterned on stretchable substrates

Submitted by Nanshu Lu on

As another celebration of March Journal Club of Mechanics of Flexible Electronics, this paper has just been submitted.

Abstract 

In one design of flexible electronics, thin-film islands of a stiff material are fabricated on a polymeric substrate, and functional materials are grown on these islands. When the substrate is stretched, the deformation is mainly accommodated by the substrate, and the islands and functional materials experience relatively small strains. Experiments have shown that, however, for a given amount of stretch, the islands exceeding a certain size may delaminate from the substrate. We calculate the energy release rate using a combination of finite element method and complex variable method. Our results show that the energy release rate diminishes as the island size or substrate stiffness decreases. Consequently, the critical island size is large when the substrate is compliant. We also obtain an analytical expression for the energy release rate of debonding islands from a very compliant substrate.

Self Introduction for ES 242r PS1 Q1

Submitted by Nanshu Lu on

My name is Nanshu Lu. I am a second year doctoral student in the Suo group at Harvard Engineering and Applied Science.

I obtained my B.S. in Solid Mechanics from the Department of Engineering Mechanics at Tsinghua University, China. You can see my resume here.

My course background includes Strength of Materials, Continuum Mechanics and Fundamental Elasticity taken at Tsinghua University and graduate level Elastisity (ES 240) taught by Prof. J. Rice, Deformation of Solids (APY 293) taught by Prof. F. Spaepen, Fracture (ES 247) and Plasticity (ES 246) taught by Prof. J. Vlassak and Zhigang's another course Advanced Elasticity (ES 241) this semester here at Harvard.

My first teaching experience was TFing Zhigang's ES 240 last semester.

Although I think I've indulged in a systematic cognition of solid mechanics with somewhat solid understanding of this subject, I sometimes do lack a spirit of digesting materials and making them my own. It indeed has occured to me that having a hard time to fish out the proper solution to a novel problem although I've owned all the needed tools and skills. Under the instruction of John and Zhigang I hope I will make the transformation from a student learner to a scholar learner.

Nonlinear fracture mechanics joints main parts of solid mechanics: fracture, elasticity and plasticity, the essential foundation to my research interests of mechanics in thin films, both theories and experiments. One of my subject is about chip packaging interaction. It is well known that nowadays a typical electronic package assembly consists of different materials which are attached together in a variety of ways. No other course will be more proper for this subject than this "Fracture mechanics of thin films and composit materials". Though I've read literatures specialized on thin film debonding I believe taking this course is the most efficient way for me to have profound and comprehensive understanding of fracture mechanics as a whole.