metal film

For flexible electronics applications it is important to understand the behavior of electrical resistance of metal films on polymer substrates under applied tensile strain. Although the growth of resistance during tensile loading was investigated in a number of research papers, the recovery of resistance during unloading remains virtually unexplored. In this paper, substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate (PET) substrates subjected to a tensile strain with different peak values.

A link for the paper: http://www.seas.harvard.edu/suo/papers/201.pdf