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A new website has been created for Prof. Raymond Mindlin, including funding solicitation for the Mindlin Medal

Submitted by Xi Chen on

A new website has been recently created for the centennial of Professor Raymond Mindlin. In addition, the Engineering Mechanics Division of ASCE has launched an effort to establish the Mindlin Medal of Applied Mechanics. The goal is to raise about $30,000 to setup an endowment at ASCE.

Pure shear decomposition of the deformation gradient for finite strain measures

Submitted by tvpc22 on

Hai,

I am wondering about deformation gradient for pure shear decompositions. As i saw much literature on simple shear, I couldn't able to track one on pure shear.

Please some one in this forum provide me with literaure and fine details.

Regards

Venkat 

 

 

Delocalizing Strain in a Thin Metal Film on a Polymer Substrate

Submitted by Teng Li on

Teng Li, Zhenyu Huang, Zhichen Xi, Stephanie P. Lacour, Sigurd Wagner, Zhigang Suo, Mechanics of Materials, 37, 261-273 (2005).

Under tension, a freestanding thin metal film usually ruptures at a smaller strain than its bulk counterpart. Often this apparent brittleness does not result from cleavage, but from strain localization, such as necking. By volume conservation, necking causes local elongation. This elongation is much smaller than the film length, and adds little to the overall strain. The film ruptures when the overall strain just exceeds the necking initiation strain, εN , which for a weakly hardening film is not far beyond its elastic limit. Now consider a weakly hardening metal film on a steeply hardening polymer substrate. If the metal film is fully bonded to the polymer substrate, the substrate suppresses large local elongation in the film, so that the metal film may deform uniformly far beyond εN. If the metal film debonds from the substrate, however, the film becomes freestanding and ruptures at a smaller strain than the fully bonded film; the polymer substrate remains intact. We study strain delocalization in the metal film on the polymer substrate by analyzing incipient and large-amplitude nonuniform deformation, as well as debond-assisted necking. The theoretical considerations call for further experiments to clarify the rupture behavior of the metal-on-polymer laminates.

Related posts and discussions

Tension of Cu film on Pi substrate
Local thinning of Cu film
High ductility of a metal film adherent on a polymer substrate


High ductility of a metal film adherent on a polymer substrate

Submitted by Yong Xiang on

In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates, and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks, and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture.

Mechanics of flexible macroelectronics

Submitted by Teng Li on

The following entry was first posted in www.macroelectronics.org on 8 May 2006.

Flat-panel displays are rapidly replacing cathode-ray tubes as the monitors of choice for computers and televisions, a commercial success that has opened the era of macroelectronics, in which transistors and other micro-components are integrated over large areas. In addition to the flat-panel displays, other macroelectronic products include x-ray imagers, thin-film solar cells, and thin-film antennas.
Like a microelectronic product, a macroelectronic product consists of many thin-film components of small features. While microelectronics advances by miniaturizing features, macroelectronics does so by enlarging systems. Macroelectronic products today are mostly fabricated on substrates of glass or silicon; they are expensive, fragile and not readily portable when their areas are large. To reduce cost and enhance portability, future innovation will come from new choice of materials and of manufacturing processes. For example, thin-film devices on thin polymer substrates lend themselves to roll-to-roll fabrication, resulting in lightweight, rugged and flexible products. These macroelectronic products will have diverse architectures, hybrid materials, and small features. Their mechanical behavior during manufacturing and use poses significant challenges to the creation of the new technologies.

A recent review paper by Suo et al. describes ongoing work in the emerging field of research – mechanics of flexible macroelectronics, with emphasis on the mechanical behavior at the scale of individual features, and over a long time. The following topics have been discussed in the paper:

Griffith controversy

Submitted by Konstantin Volokh on

Using the Griffith energy method for analysis of cavitation under hydrostatic tension we conclude that the critical tension tends to infinity when the cavity radius approaches zero (IJSS, 2006, doi: 10.1016/j.ijsolstr.2006.12.022). The conclusion is physically meaningless, of course. Moreover, if we assume that the failure process occurs at the edge of the cavity then the critical tension should be length-independent for small but finite cavities while the Griffith analysis always exhibits length-dependence. The main Griffith idea - introduction of the surface energy - is controversial because it sets up the characteristic length, say, surface energy over volume energy. By no means is this approach in peace with the length-independent classical continuum mechanics.

Is rest of the world catching up with us? Perspective from Physical Review Letters...

Submitted by Pradeep Sharma on

I had posted this on the amd blog...I am posting it here as well:

Last year I attended the annual American Physical Society conference held in Baltimore (during the week of March 13th). One of the non-technical sessions included presentations by the APS journal editors--Physical Review A/B/C/D/E and Letters---and a panel discussion related to these journals. Since many of our mechanics and materials colleagues nowadays are interested in publishing in these journals, I thought I should post a link to some of the slides (from the editors presentation) that I found interesting. Many of the slides presented at APS are in the linked pdf file that also includes additional (humorous slides!) regarding reviewer issues.

The Ranking of Mechanics Related Journals (2004)

Submitted by shaofanli on

Based on a survey from Journal Citation Report (JCR), we listed below the 2004 Journal Impact Factors (IF) for some mechanics, material science, and solid state physics related scientific journals. Our list and information may not be complete. We welcome readers' input, comments, and information. We also caution readers that using IF as the sole criterion to rank scientific journals' academic reputation may not be objective nor true to a journal's actual scientific merits.