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SES 2017 - Failure and Damage in Soft Materials - Call for Abstracts -

talamini's picture

We invite you to submit your abstract for the symposium, "Failure and Damage in Soft Materials: From Cavitation to Cracking", at the 54th annual technical meeting of the Society of Engineering Science (SES 2017), July 25-28, in Boston MA. Information about the meeting may be found at

Across many fields, the continuing revolution in the development of soft materials is transforming
the engineering of devices. In many applications, harnessing the potential of soft materials hinges on
whether mechanical failure can be prevented or controlled. One of the relevant failure pathways is through
free surface-creating processes, such as rupture, cavitation, and adhesive debonding. In contrast to hard
materials, in soft devices the length scale of fracture-type processes is often comparable to the structural
dimensions, and thus fracture cannot be decoupled from the rest of the response. Analyzing these phenomena
requires the development of new approaches and techniques. Additionally, the presence of competing
dissipation mechanisms|e.g., the Mullins effect, viscous flow, solvent diffusion, formation and breaking of
temporary bonds complicate the picture, but also provide opportunities to tailor toughness in new ways.
This session will focus on failure mechanisms in soft materials, encompassing experimental techniques to
characterize, prevent or control failure in soft materials, and modeling efforts to understand failure mechanisms through theoretical and numerical techniques.  Works relating to experiments and theory on self-healing phenomena in elastomers will also be sought.

The symposium is number I-D. Please submit your abstract here:

or follow the submission link on the symposium description web page:

The deadline for submission is April 15, 2017.


B. Talamini, Massachusetts Institute of Technology

O. Lopez-Pamies, University of Illinois Urbana-Champaign

K. Ravi-Chandar, The University of Texas at Austin

T. Zhang, Syracuse University

Y. Mao, Massachusetts Institute of Technology

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