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Indentation: A widely used technique for measuring mechanical properties

Submitted by Manhong Zhao on

Indentation is one of the most widely used techniques of measuring mechanical properties of materials, especially for materials of small volume. In micro- or nano- scales, performing traditional tests such as the tension test and bending test becomes less feasible because of the nontrivial task of sample preparation. In contrast, by using the indentation technique, the difficulty of sample preparation may be dramatically reduced. On the other hand, indentation test is not a direct measurement and advanced mechanics analysis is needed to correlate the material properties with the indentation response. 

In an indentation test, a hard tip is pressed into a sample. The tip can be sharp or spherical. After the tip is removed, an impression is left. The hardness is defined as the indentation load divided by the projected area of impression. Moreover, by means of instrumental indentation testers, the indentation load and indentation depth can be continuously and simultaneously measured. Many models have been developed to extract the material properties from the recorded indentation load-depth curve, including the elastic modulus, yield stress, strain hardening coefficient, residual stress, fracture toughness, etc. 

The Effect of Water Diffusion on the Adhesion of Organosilicate Glass Film Stacks

Submitted by Anonymous (not verified) on

Ting Y. Tsui, Andrew J. McKerrow, and Joost J. Vlassak

Published in the Journal of The Mechanics and Physics of Solids, 54 (5), 887-903 (2006)

Abstract – Organosilicate glass (OSG) is a material that is used as a dielectric in advanced integrated circuits. It has a network structure similar to that of amorphous silica where a fraction of the Si-O bonds has been replaced by organic groups. It is well known from prior work that OSG is sensitive to subcritical crack growth as water molecules in the environment are transported to the crack tip and assist in rupturing Si-O bonds at the crack tip. In this study, we demonstrate that exposure of an OSG containing film stack to water prior to fracture results in degradation of the adhesion of the film stack. This degradation is the result of the diffusion of water into the film stack. We propose a quantitative model to predict adhesion degradation as a function of exposure time by coupling the results of independent subcritical crack growth measurements with diffusion concentration profiles. The model agrees well with experimental data and provides a novel method for measuring the water diffusion coefficient in film stacks that contain OSG. This study has important implications for the reliability of advanced integrated circuits.