Hi,
Is there anyone aware of the reason why there is a surge in hardness value during the initial stages of penetration in nanoindentation curve. In a plot of hardness vs displacement into surface, I record a high value during the initial stages of the run. I am little confused about the reason.
Thanks,
atul
The ability of a material to resist cracking, or fracture, has been vital to the studies of fracture mechanics. Until recently the study of fracture toughness has been analyzed at a macro range using powerful instrumentation applied to large samples.
Creep can be characterized as the result of a solid material that is slowly and permanently deformed under the influence of stress. Deformation results from the consistent stress below the yield strength of the material. The amount of applied stress and its duration can eventually lead to the failure of the given material. Ultimately, it is for this reason that Nanoindentation creep measurement provides crucial information to study material behavior.
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The Stress-Strain curve obtained by Nanoindentation reveals the correlation of "Stress" and"Strain" of a given material under nano controlled loads. Unlike the traditional Tensile Testing method of obtaining Stress-Strain curve data, which gives data at a macro level, the Nanoindentation method provides vital Stress-Strain curve data at nano level scale without the large and intense machinery. The Stress-Strain curve of various materials will vary widely.
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The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The hardness and strength of a wafer must be much greater then the conditions imposed during manufacturing to insure a failure will not occur. Here nanoindnetation is used.
