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Modeling of cohesive zone model (CZM) using MSC.Marc

Submitted by wangyl on
research

Hello everybody,

I am a new comer here and I need some help. I want to simulate the interface debonding process of  bimaterial using the commercial FE software msc.marc, but I want to use my own cohesive law not the one given by the marc. so the user subrotine UCOHESIVE must be used, the problem is I dont know how to program using FORTRAN. I hope some one here can help me, if  you have such a user subrotine, can you kindly sent it to me? that will give me a great hand. Thank you very much. Expect your reply.

Newsletter for the ASME Committee on Constitutive Equations - Summer 2008

Submitted by Gregory M. Odegard on
research
constitutive modeling
constitutive equations

Mechanics community,

Please find attached the summer 2008 edition of the ASME Committee on Constitutive Equations Newsletter.  Included in the newletter is an article written by Prof. Ostoja-Starzewski on "Homogenization and Size of Representative Volume Element (RVE)".

 

Thanks,

Greg Odegard

Accounting for the overhang (or under etch) in MEMS resonantor structures

Submitted by adiga on
research
Overhang or under etch in cantilever resonantor structures

Hi,

 

   I am wondering if there is a simple way to account for the overhang (or the under etch) in cantilever resonator structures when we are estimating for the resonant frequency of the  same. It will be a great help.

 

Thanks,

 

Vivek Adiga 

Thin Material

Submitted by Masayuki Wakamatsu on
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Intefacial Fracture

Hello, imechanicians,

  If you are (or to be) an experimentalist and have a good idea, please help me!

  I have a Si - Si DCB and would like to initiate a crack and hold it as it is (similar to a crack initiated in mica with a razor blade) According to my calculation, I need something like 1 to 5 um thickness. It could be sometime like a wedge shape.

  If you have any good idea, please give me a suggestion!

 Thank you,

Masa

Young Modulus versus temperature

Submitted by Martin Della Torre on
research

Hi.

This is a material's problem.

I'm trying to simulate in FEA (Ansys) a part of a rectangular duct. this duct works with a flue gases qith elevated temparature (aporx 300°C).

Does anyone knows any standard (ASTM or similar) or any bibliography who gives data in form of tables or graphics that shows the variation of young modulus against temperature variation for materials?

 

Thanks

Martin

Does a scientist who has had three patents in the past five years, but only three papers, each cited just three times, deserve m

Submitted by Mike Ciavarella on
research
research
publications

From the blogosphere

Nature 453, x (2008). doi:10.1038/7196xc

Does a scientist who has had three patents in the past five years,
but only three papers, each cited just three times, deserve more
recognition than one with five Nature papers and 1,000 citations? 

 

Can anyone download the full paper I have no access to Nature!!!! 

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