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thermal stress in ANSYS

Submitted by F. Mattedi on
Forums
Materials Forum

Hallo,

I'm using ANSYS for study the internal stresses of a trilayer structure resulting after a cooling process. The middle layer (the solder) has temperature dependent material properties and the other two layers can be considered temperature indipendent mat. properties. If I use a static analysis the software uses the material properties reffered to final temperature.

For an linear elastic analysis is this a realistic procedure?

If the solder deforms plastically at high temperature and not at final temperature..how can I do?

International Workshop on Mechanics of Wood & its Applications in Wind Energy Technogies, Dhulikhel, Nepal, 10-12 November 2008

Submitted by Leon Mishnaevsky on
conference

The International Workshop on Mechanics of Wood and its Applications in Wind Energy Technologies will take place 10-12 November 2008 in Dhulikhel, Nepal.

wear of articulating surface of joint replacement

Submitted by Muhsin Salim on
research
fortran subroutine codes to solve wear equation

Hi everyone out there...

Now i'm working on biomechanics research project which deals with the articulating surface of joint replacement, where one of the main problem were the wear of sliding contact (i.e., metal on polymer,metal on metal or polymer on ceramics).wear debris or particles generated from this articulating surface can causes the damage of the bone cell around the joint replacement.My question are;

A review on Chip-Package Interaction and Its Impact on Reliability of Cu/low k Interconnects

Submitted by Rui Huang on
industry
fracture mechanics
interconnect
electronic package
reliability
R. Huang Group Research
microelectronics

X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008. 

Abstract: 

The factory idiom and material models

Submitted by Biswajit Banerjee on
computational mechanics
Plasticity
C++

I'm leaving the US in a couple of days and will probably take a hiatus of a few months from iMechanica.  Before I leave, I want to tell you about a C++ idiom that eases the implementation and use of multiple material models in a computational mechanics code.

Entropic-elasticity-controlled dissociation and energetic-elasticity-controlled rupture induce catch to slip bonds in cell-adhes

Submitted by Yujie Wei on
research
cell mechanics
catch bonds slip bonds
receptor-ligand interaction
bond lifetime

In order to achieve a wide variety of biological phenomena, the abilities of cells to contact effectively and interact specifically with neighboring media play a central role. It is known that cells can sense the chemical and mechanical properties of surrounding systems and regulate their adhesion and movement through binding protein molecules within cell membrane. The kinetics of binding molecules interacting with ligands is of great interest in biophysical society. There are lots of discussions and contributions on cell mechanics from our mechanical society, e.g.

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