Recent results on fluid-structure interaction for plates subject to high intensity air shocks are employed to assess the performance of all-metal sandwich plates compared to monolithic solid plates of the same material and mass per area. For a planar shock wave striking the plate, the new results enable the structural analysis to be decoupled from an analysis of shock propagation in the air. The study complements prior work on the role of fluid-structure interaction in the design and assessment of sandwich plates subject to water shocks. Square honeycomb and folded plate core topologies are considered. Fluid-structure interaction enhances the performance of sandwich plates relative to solid plates under intense air shocks, but not as significantly as for water blasts. The paper investigates two methods for applying the loading to the sandwich plate-responses are contrasted for loads applied as a time-dependent pressure history versus imposition of an initial velocity. Click here for the full paper.

Selective oxidation induced void growth is observed in thermal barrier coating (TBC) systems used in gas turbines. These voids occur at the interface between the bond coat and the thermally grown oxide layer. In this article we develop the modeling framework to simulate microvoid growth due to coupled diffusion and creeping in binary alloys. We have implemented the modeling framework into an existing finite element program. The developed modeling framework and program is used to simulate microvoid growth driven by selective oxidation in a binary beta-NiAl alloy. Axisymmetric void growth due to the combined action of interdiffusion and creeping is simulated. The sharpness of the void and direction of creeping are considered as parameters in our study. Our simulations show that the voids dilate without any change in shape when creeping is equally likely in all the directions (isotropic). Void growth patterns similar to those observed in experiments are predicted when the creeping is restricted to occur only along the radial and tangential directions. A hemispherical void grows faster compared to a sharp void. The sharpness increases in the case of a sharp void and could lead to interactions with the neighboring voids leading to spallation of the thermally grown oxide layer as observed in experiments.

As an indenter penetrates an elastoplastic material, the indentation load P can be measured as a continuous function of the indentation displacement δ, to obtain the so-called P-δ curve. A primary goal of the indentation analysis is to relate the material elastoplastic properties (such as the Young's modulus, yield stress, and work-hardening exponent) with the indentation response (i.e. the shape factors of the P-δ curve, including its curvature, unloading stiffness, loading work, unloading work, maximum penetration, residual penetration, maximum load, etc.).

Rui Huang and Se Hyuk Im, Physical Review E 74, 026214 (2006).

A stressed thin film on a soft substrate can develop complex wrinkle patterns. The onset of wrinkling and initial growth is well described by a linear perturbation analysis, and the equilibrium wrinkles can be analyzed using an energy approach. In between, the wrinkle pattern undergoes a coarsening process with a peculiar dynamics. By using a proper scaling and two-dimensional numerical simulations, this paper develops a quantitative understanding of the wrinkling dynamics from initial growth through coarsening till equilibrium. It is found that, during the initial growth, a stress-dependent wavelength is selected and the wrinkle amplitude grows exponentially over time. During coarsening, both the wrinkle wavelength and amplitude increases, following a simple scaling law under uniaxial compression. Slightly different dynamics is observed under equi-biaxial stresses, which starts with a faster coarsening rate before asymptotically approaching the same scaling under uniaxial stresses. At equilibrium, a parallel stripe pattern is obtained under uniaxial stresses and a labyrinth pattern under equi-biaxial stresses. Both have the same wavelength, independent of the initial stress. On the other hand, the wrinkle amplitude depends on the initial stress state, which is higher under an equi-biaxial stress than that under a uniaxial stress of the same magnitude.

See an accompanying powerpoint presentation: The aged-rejuvenation-glue-liquid (ARGL) shear band model has been proposed for bulk metallic glasses (Acta Mater. 54 (2006) 4293), based on small-scale molecular dynamics simulations and thermomechanical analysis. The model predicts the existence of a critical lengthscale ~100 nm and timescale ~100 ps, above which melting occurs in shear-alienated glass. Large-scale molecular dynamics simulations with up to 5 million atoms have directly verified these predictions. When the applied stress exceeds the glue traction (computed separately before), we indeed observe maturation of the shear band embryo into bona fide shear crack, accompanied by melting.

The deadline of October 1, 2006 for my program of Mechanics & Structures of Materials was inadvertently omitted in our website. However, at the beginning of our CMS home page there are 2 deadlines listed for all programs. In the meantime any unsolicited proposals for my program, please put in GPG 04-23 as the Program Announcement [1st box]. In the 2nd box put in my program name [Mechanics & Structures of Materials].

A recent discussion here about the effect of surface stress on vibrations of microcantilever has gained some interest from our members. A few years ago, Zhigang and I looked at surface effect on buckling of a thin elastic film on a viscous layer (Huang and Suo, Thin Solid Films 429, 273-281, 2003). Although the physical phenomena (buckling vs vibrations) are different, the conclusion is quite consistent with Wei Hong and Pradeep's comments toward the end of the discussion. That is, surface stress only contributes as a residual stress and thus does not affect the buckling wavelength (frequency in space in analogy to frequency in time for vibrations).

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One of the most common forms of cohesive failure observed in brittle thin film subjected to a tensile residual stress is channel cracking, a fracture mode in which through-film cracks propagate in the film. The crack growth rate depends on intrinsic film properties, residual stress, the presence of reactive species in the environments, and the precise film stack. In this paper, we investigate the effect of various buffer layers sandwiched between a brittle carbon-doped-silicate (CDS) film and a silicon substrate on channel cracking of the CDS film.

It is well established that the growth of microscopic voids near a crack tip plays a fundamental role in establishing the fracture behavior of ductile metals. Mechanics analyses of plastic void growth have typically assumed the plastic properties of the surrounding metal to be isotropic. However voids are typically of the order of magnitude of one micron so that they exist within individual grains of the metal, or along grain boundaries, at least at the initial growth stage. For that reason, the plastic properties of the material surrounding the void are most properly treated as being anisotropic, rather than isotropic.

In the uploaded preprint, the stress state and deformation state are derived around a cylindrical void in a hexagonal close packed single crystal. The orientation of the cylindrical void and the loading state relative to the crystal are chosen so that the deformation state is one of plane strain. The active slip systems reduce to a total of three slip systems which act within the plane of plane strain. The solution shows that the deformation state consists of angular sectors around the void within which only one slip system is active. Further, it is shown that the stress state and deformation state exhibit self-similarity both radially and circumferentially, as well as periodicity along certain logarithmic spirals which emanate from the void surface.