The ASME International Mechanical Engineering Congress and Exposition (IMECE) will be held in 11-16 November 2007, in Seattle, Washington. As the 2007 Program Chair of the Applied Mechanics Division (AMD), I hope to get you involved in planning activities at the Congress.

IMECE is a place where you can meet people and attend talks in Applied Mechanics, as well as in other fields, such as Materials, Electronic Packaging, Tribology, and Heat Transfer. For many mechanicians, a highlight of the Congress is the Applied Mechanics Annual Dinner, where old acquaintances are resumed, new friends made, awards announced, and the Timoshenko lectures delivered.

[img_assist|nid=46|title=|desc=|link=url,http://www.materialstoday.com/2006_issues/april.htm|align=right|width=75|height=100]The cover story of the April 2006 issue of Materials Today features Flexible Electronics. This issue also includes two review articles in this emerging field of research. Access to full text articles is free of charge at http://www.materialstoday.com.

Review Article:

Material challenge for flexible organic devices, by Jay Lewis

Review Article:

Organic and polymer transistors for electronics, by Ananth Dodabalapur

Cover Story:

Jet printing flexible displays, by R.A. Street et al.