Crack Propagation by XFEM
Hai everyone.
Good day, i'm a new to XFEM who currently doing research in electronic field. I'm thinking about since the crack can be propagated without a crack tip by strain loading, how about the crack propagation by using thermal loading? I didn't see any example of this kind of problem, so can anyone tell me is that possible to do such simulation? Your suggestion is important for me and will be highly appreciated.
Thanks in advance.