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low-k dielectric

Water diffusion and fracture behavior in nano-porous low-k dielectric film stacks

Submitted by Li Han on
research
fracture
porous
low-k dielectric
diffusion
Among various low-dielectric constant low-k materials under development, organosilicate glasses
OSGs containing nanometer-size pores are leading candidates for use as intrametal dielectrics in
future microelectronics technologies. In this paper, we investigate the direct impact of water
diffusion on the fracture behavior of film stacks that contain porous OSG coatings. We demonstrate
that exposure of the film stacks to water causes significant degradation of the interfacial adhesion

State-of-the-art understanding of cracking for porous materials?

Submitted by Al Zappor on
adhesion
fracture
interface
porous
low-k dielectric

It seems there are quite a few experimental studies [1,2] on the fracture properties of porous materials, like nanoporous low-k dielectrics, as a function of porosity. Can anyone point out some references on the theoretical part, like the available models, computational methods or analytical approaches that can capture microstructure information, including porosity, pore geometry etc. Interface delamination of porous materials is also of interest. Thanks.

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