User login

Navigation

You are here

low-k dielectric

Li Han's picture

Water diffusion and fracture behavior in nano-porous low-k dielectric film stacks

Among various low-dielectric constant low-k materials under development, organosilicate glassesOSGs containing nanometer-size pores are leading candidates for use as intrametal dielectrics infuture microelectronics technologies. In this paper, we investigate the direct impact of waterdiffusion on the fracture behavior of film stacks that contain porous OSG coatings.

State-of-the-art understanding of cracking for porous materials?

It seems there are quite a few experimental studies [1,2] on the fracture properties of porous materials, like nanoporous low-k dielectrics, as a function of porosity. Can anyone point out some references on the theoretical part, like the available models, computational methods or analytical approaches that can capture microstructure information, including porosity, pore geometry etc. Interface delamination of porous materials is also of interest. Thanks.

Subscribe to RSS - low-k dielectric

Recent comments

More comments

Syndicate

Subscribe to Syndicate