3D finite element modeling for instabilities in thin films on soft substrates
Xu, F., Potier-Ferry, M., Belouettar, S., Cong, Y.,
International Journal of Solids and Structures (2014), doi: http://dx.doi.org/10.1016/j.ijsolstr.2014.06.023
Abstract:
Xu, F., Potier-Ferry, M., Belouettar, S., Cong, Y.,
International Journal of Solids and Structures (2014), doi: http://dx.doi.org/10.1016/j.ijsolstr.2014.06.023
Abstract:
Most technologically relevant ferroelectrics typically lose piezoelectricity above the Curie temperature. This limits their use to relatively low temperatures. In this Letter, exploiting a combination of flexoelectricity and simple functional grading, we propose a strategy for high-temperature electromechanical coupling in a standard thin film configuration.
Dear Colleagues,
We would like to invite you to participate in a symposium on “Modeling and experimental characterization for the behavior of the micro/nanostructured thin films” in ASME 2014 International Mechanical Engineering Congress and Exposition in Montreal, Canada ( http://www.asmeconferences.org/congress2014/).
Dear all,
I was curious whether there are any
experimental information and / or results regarding the out of plane (anti-plane)
deformation of (very) thin films. For example an elastic thin film subjected to anti-plane loading on its surface. Any other suggestions regarding possible applications of anti-plane loading conditions in thin films would be appreciated.
Thanks a lot,
Thanasis
Improved barrier properties in polyolefins (Job Code: ME-PDSK032013)