Flexible Batteries: From Mechanics to Devices
Flexible Batteries: From Mechanics to Devices, Kun Kelvin Fu, Jian Cheng, Teng Li, and Liangbing Hu, ACS Energy Letters 1, 1065−1079 (2016)
Flexible Batteries: From Mechanics to Devices, Kun Kelvin Fu, Jian Cheng, Teng Li, and Liangbing Hu, ACS Energy Letters 1, 1065−1079 (2016)
Dear colleagues,
You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.
Published in Advanced Functional Materials as a Feature Article!
Possessing a strong piezoresistivity, nanocomposites of metal nanowires and elastomer have been studied extensively for its use in highly flexible, stretchable, and sensitive sensors. In this work, we analyze the working mechanism and performance of a nanocomposite based stretchable strain sensor by calculating the conductivity of the nanowire percolation network as a function of strain. We reveal that the nonlinear piezoresistivity is attributed to the topological change of percolation network, which leads to a bottleneck in the electric path.
Super-stretchable, skin-mountable, and ultra-soft strain sensors are presented by using carbon nanotube percolation network–silicone rubber nanocomposite thin films. The applicability of the
strain sensors as epidermal electronic systems, in which mechanical compliance like human skin and high stretchability (e > 100%) are required, has been explored. The sensitivity of the strain
Call for papers
2009 MRS Spring Meeting, San Francisco, CA, April 13-17
Symposium PP: Materials and Devices for Flexible and Stretchable Electronics
Abstract Deadline: 3 November 2008
In this paper, we report comprehensive experimental and theoretical
studies of bending in structures relevant to inorganic flexible electronics.
Different from previous mechanics models of related systems, our analysis does not
assume the thin film to cover the entire substrate, thereby explicitly
accounting for effects of edges and finite device sizes, both of which play
critically important roles in the mechanics and bending properties. These
thin-film islands give nonuniform stress, with maxima that often appear at the
edges and spatially non-uniform shear and normal stresses along the film/substrate
interface. Although these results are generally applicable to all classes of