H. Mei, Y. Pang, and R. Huang, International Journal of Fracture 148, 331-342 (2007).
Following a previous effort published in MRS Proceedings, we wrote a journal article of the same title, with more numerical results. While the main conclusions stay the same, a few subtle points are noted in this paper.
Attached slides were presented at the 2007 ASME Congress at Seattle.
I attach slides for an ASME talk, which is based on a recent paper.
This is a winning entry in the Sci/Terp Video Competition at University of Maryland (UMD).
Hi, I'm a Physics grad student working with Dr. Ellen Williams. My job is basically making nanoelectronic devices, measuring their characteristics and trying to understand the underlying "Physics".
What I want to gain from this course is to come to know how flexible macroelectronics are approached and researched. An increasing trend of "thin" applications poses new challenges in terms of low power usage and durability.
My name is Daniel Min. I am a senior mechanical engineering student at the University of Maryland. I am currently enrolled in Dr. Teng Li's flexible macroelectronics course. I chose to enrol
I am Yong Wang, currently a PhD student in the Mechanical Engineering department at the University of Maryland. I got my Bachelor degree from the University of Science and Technology of China and Master degree from the Hong Kong University of Science and Technology. I am enrolled in Dr. Teng Li's class on flexible macroelectronics in this semester.
My name is Kurt Vargas. I am an international student from Costa Rica, currently attending the University of Maryland at College Park. I am a Christian who loves the Lord and serves Him full time. I also love reading my Bible!
