Journal Club January 2011: Mechanics and Materials for Solar Energy
Brian C. McGuigan and Harley T. Johnson, UIUC
Brian C. McGuigan and Harley T. Johnson, UIUC
Polarization distributions around an open crack with different electrical boundary conditions in a single crystal ferroelectric are investigated by using a phase field model. The surface effect of polarization is taken into account in the phase field model, which has not been included in previous ferroelectric crack models. The simulation results show that the impermeable crack and the crack filled with air have a significant influence on the polarization distribution, while the permeable and the crack filled with water have little influence.
i am working on ABAQUS, trying to carry out pushover analysis, modeled dam body as well as foundation, can anybody explain me how to carry out pushover analysis of dam ,as well as which interaction is suitable in between dam and foundation interface.
thank you in advance.
This is a preprint of an article that will appear in the Philosophical Magazine Letters.
Linear Instability Signals the Initiation of Motion of a Twin Plane Under Load
by Chang-Tsan Lu and Kaushik Dayal
Abstract
Hi All,
i am doing my m. tech project on " FE modeling and validating to find stress intensity factor for a crack emanating from one rivet hole and approaching another rivet hole".I have developed the FE model in ANSYS and tabulated stress intensity factor at crack tip from different crack length. But to validate my result i want an mathematical model or formula. Please suggest me an formula to find KI at the crack tip for this problem.
I have extracted field output from ABAQUS odb file and I want to take log of that field. In ABAUQS scripting manual, in section 9.8.2 it has been mentioned that
log10(field output)= field output
When I am trying to do this compilation gives me error. "a float value required"
Please guide me if i am making any mistake
Also if possible, suggest how can I get rid of this problem?
I'm currently studying FEA/CFD and BEM for thermal simulation of custom dies within custom package mounted on custom PCB with encapsulate material (epoxy). I getting familar with CFD concept which seem overkill from ANSYS IcePack (too expensive) but exploring BEM technology from E3D in france (via Vishay).
I have access to MATLAB from other company to try it out for thermal modelling (BEM).