EMI 2015, the annual conference of the Engineering Mechanics Institute of ASCE, will be held at Stanford University on June16-19, 2015. It will be chaired by Prof. Ronaldo Borja ( Department of Civil Engineering, Stanford University).
Immediate Openings for a Post-Doctoral Researcher and Ph.D. student
at
Johns Hopkins University
Center of Excellence in Integrated Materials Modeling (CEIMM)
http://ceimm.jhu.edu, http://cmrl.jhu.edu
A postdoctoral positions in Computational Materials is available in the group of Peter Kroll in the Department of Chemistry and Biochemistry at UT Arlington, Arlington, TX. The project focuses on boron nitride, its conversion from "soft" hexagonal to "hard" cubic boron nitride, structural developments during sintering, and mechanical properties. Applicants will have a strong record in solid-state materials simulation and the demonstrated ability to work independently and drive a project.
Dear Mechanicians,
The following advertisement for a tenure track faculty position will be of interest to you. Please feel free to contact me if you have queries.
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There have been several discussions on "Extreme Mechanics" in recent weeks and I would like to extend this topic to "Extreme Computing". As we develop materials that are more complex, hierarchical and are spanning multiple spatial scales, we will need computational tools that can describe them well. Fluid dynamics community has long time ago embraced large-scale computing of conservation laws of mass, momentum and energy. In mechanics of materials, large-scale computing is still in infancy.
For flexible electronics applications it is important to understand the behavior of electrical resistance of metal films on polymer substrates under applied tensile strain. Although the growth of resistance during tensile loading was investigated in a number of research papers, the recovery of resistance during unloading remains virtually unexplored. In this paper, substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate (PET) substrates subjected to a tensile strain with different peak values.
All -
Are there good references related to acoustic heating? I am interested in the ability to scale down the effects of this process and looking for ideas in model development to assist.
Regards,
Luke
