Rui Huang's blog
A symposium on Mechanical Instabilities in Polymer Films, Interfaces and Nanostructures
This symposium is part of the Spring 2008 ACS National Meeting and Exposition , to be held at New Orleans, Louisiana, from Sunday, April 6 to Thursday, April 10, 2008.
Organizers: Christopher M. Stafford (NIST), Adam J. Nolte (NIST), Rui Huang (UT Austin)
Sponsors: ACS Division of Polymeric Materials: Science and Engineering (PMSE) and National Science Foundation
Technical Program:
Symposium on Mechanics of Integrated Materials and Structures in Advanced Technologies, at 2008 ASME Congress
As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME Applied Mechanics Division (AMD).
When and Where: October 31 - November 6, 2008, Boston, Massachusetts.
Abstract submission deadline: March 3, 2008
A review on Chip-Package Interaction and Its Impact on Reliability of Cu/low k Interconnects
X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chapter 2 in Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.
Abstract:
EM 388F Homewrok Problems 2-5
One file is attached.
Add Problem 5: use the method of superposition to obtain the stress field around a hole in an infinite sheet under uniaxial remote stress.
Due date extended to Monday, January 28, 2008.