fracture

Sungmin Hong, Dalton Sycks, Hon Fai Chan, Shaoting Lin, Gabriel P. Lopez, Farshid Guilak, Kam W. Leong, Xuanhe Zhao, Advanced Materials, 27, 4035-4040, 2015. 

A new postdoctoral fellow position is available within the Hopkins Extreme Materials Institute (hemi.jhu.edu) at Johns Hopkins University.  The position is in the area of experiments and modeling of inelastic deformations in geological materials (including damage and micromechanics of fracture) under impact mechanical loading conditions.  The potential candidate will (a) assist in the development of theoretical and computational models for dynamic behavior and failure of geological materials, (b) closely interact with experts in x-ray phase contrast imaging to characterize microcr

Three post-doctoral positions are available at the University of Luxembourg with the ERC RealTCut project.
See http://www.legato-team.eu for details on the team and the attached PDF for the pre-requisites and possible research areas.

Regards,

Stéphane

DEPARTMENT:  Department of Energy

AGENCY:  National Energy Technology Laboratory

LEVEL:  Post-Doctoral

POSITION INFORMATION:  Temporary, 12 months full-time with the possibility of extension

DUTY LOCATION:  Albany, Oregon

WHO MAY BE CONSIDERED:  United States Citizens, LPRs, and Foreign Nationals with appropriate approval

We are pleased to announce a 4-day CECAM/Psi-k Workshop on

"Chemical and structural transformations in materials under mechanical load",

 that will take place at the EPFL campus in Lausanne from Tuesday 1st September to Friday 4th September 2015.

The focus of the workshop will be on materials’ structural and chemical transformations that are caused by external loads and in turn determine the materials macroscopic mechanical response. Particular attention will be devoted to the following thematic areas:

Dear Colleagues:

We are pleased to announce a mini-symposium on Fracture Mechanics at the 52^nd Annual Technical Meeting of the Society of Engineering Science, to be held at the Texas A&M University, College Station, Texas, October 26-28, 2015.

Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS).  Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization.  In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh u