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Call for Abstract Submission to SES2016 Symposium C-5: Molecular, Cellular, and Tissue Mechanics

Submitted by Ying Li on

Dear Colleagues,

You are cordially invited to submit your one-page abstract to our Symposium C-5: Molecular, Cellular, and Tissue Mechanics for

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) 

Date & Location:

University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.

 

Call for abstracts: 2016 SES Conference: Symposium C-1: Bio-Adhesive Contacts and Biomimetics with Extreme Properties

Submitted by Yanfei Gao on

Dear Colleagues:

You are cordially invited to contribute to the following symposium at SES 2016. Please note the deadline of 6/15/2016. Many thanks!

 

http://ses2016.org/symposium-c-1-bio-adhesive-contacts-and-biomimetics-…

 

Symposium C1: Bio-Adhesive Contacts and Biomimetics with Extreme Properties

 

[Call for Abstract] SES 2016 Symposium F-3: Wave Phenomena in Linear and Nonlinear Metamaterials

Submitted by stefanogonella on

We would like to invite you to submit an abstract to the symposium F-3: Wave Phenomena in Linear and Nonlinear Metamaterials at the SES 53rd Annual Technical Meeting (SES2016) to be held October 2-5 2016 in College Park, MD.

Symposium Technical Description

Call For Abstracts: 2016 SES Symposium D-14 "Non-linear Response of Highly Deformable Structures"

Submitted by zichen on

We would like to invite you to submit abstracts to Symposium D-14: Non-linear Response of Highly Deformable Structures within the “Mechanics of Solids and Structures” track at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES 2016), hosted by the University of Maryland, October 2-5, 2016.

The deadline for abstract submission is June 15, 2016.

Symposium Technical Description

Call for Abstracts SES - Mechanics of Polymers with Dynamic Bonds

Submitted by Meredith N. Si… on

Dear Colleagues,

We invite you to submit an abstract to "Mechanics of Polymers with Dynamic Bonds" (Symposium C-3) at the Society for Engineering Science annual conference this fall. SES will take place Oct 2-5, 2016 at the University of Maryland. The abstract deadline is June 15th. Further conference details can be found at ses2016.org.

Simpleware at NAFEMS UK 2016, June 15-16

Submitted by Simpleware on

The 2016 NAFEMS UK Regional Conference will cover a wide range of topics, addressing every aspect of engineering analysis and simulation during a 2-day program. The 2016 conference will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum. Covering all aspects of the technology including FEA, CFD & MBS, the event will focus heavily on best-practice, use cases, state of the art, problem areas, developing fields and much more.

Simpleware at NAFEMS UK Conference 2016

[Call for ABSTRACT] 2016 SES Symposium D-5 on Mechanics and Design of Mechanical Metamaterials by 06/15/2016

Submitted by Jie. Yin on

We would like to invite you to submit abstracts for oral presentations to Symposium D-5 on “Mechanics and Design of Mechanical Metamaterials” at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES 2016), hosted by the University of Maryland College Park during 2-5 October 2016.

Symposium on "Computational Mechanics of Materials and Structures" at the Society of Engineering Science Meeting

Submitted by shawnchester on

Dear Colleagues:

We are writing to draw your attention to Symposium D-8, titled "Computational Mechanics of Materials and Structures" within the "Mechanics of Solids and Structures" track of the 53rd Annual Technical Meeting of the Society of Engineering Science (SES) to be held at the University of Maryland, October 2-5, 2016.  The symposium description may be found below, and we encourage you to submit an abstract.  Fur further details and to submit an abstract, please see the meeting website ses2016.org.

Simpleware at the ANSYS Automotive Simulation World Congress, June 7-8 2016, Munich

Submitted by Simpleware on

ASWC will be attended by over 350 professionals from over a 100 companies and organizations. AT the event 70 presentations will be delivered by experts from major global car, truck and off-highway manufacturers, tier-1 suppliers, prominent universities, and research centers. Attendees will have a unique opportunity to meet automotive simulation leaders, see how major global companies are using simulation, learn best practices, see the latest technology advances, and network with peers from around the world. 

Simpleware at ASWC