Dear colleagues,
You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.
Dear Colleagues,
The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.
We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”
Dear Colleagues,
Please consider submitting abstract(s) to Symposium D-11 "Instability and Interfacial Adhesions in Bio-Compatible Electronics" at the 2016 SES meeting to be held at the University of Maryland-College Park During October 2-5, 2016. Abstract due: June 15, 2016.
Dear Colleagues,
You are warmly invited to submit your one-page abstract to our Symposium E-3: Advanced Nano-Manufacturing for Multi-functional Nanosystems for the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016)
Deadline for submission of Abstracts is June 15, 2016.
Co-organizers:
The 53rd Annual Technical Meeting of the Society of Engineering Science will be held at the University of Maryland (UMD), 2-5 October 2016. We are organizing a symposium on Architectured Metamaterials which will cover research on the structure, mechanics, design, optimization, fabrication and mechanical performance of all categories of architectured materials including but not limited to lattice materials, metamaterials, topologically interlocked materials and bio-inspired materials. We expect that the SES meeting and this symposium will offer a great platfor
Soft materials are ubiquitous in nature, from biopolymers, cells, and tissues to organs. In recent years, soft materials have been intensively explored in different engineering applications, ranging from haptic devices to soft robotics, from flexible electronics to biomimetic systems. Fundamental studies of the deformation mechanisms of soft materials and optimal designs in different applications urgently need robust methods for material characterization.
Dear Colleagues,
We would like to invite you to consider submitting abstracts to the following minisymposium taking place as part of the Soceity of Engineering Sciences meeting to be hosted by the University of Maryland (October 2-5, 2016)
D-9 :Friction, Fracture and damage (http://ses2016.org/symposium-d-9-friction-fracture-and-damage/)
Dear Colleagues,
You are cordially invited to submit your one-page abstract to our Symposium C-5: Molecular, Cellular, and Tissue Mechanics for
The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016)
Date & Location:
University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.
Dear Colleagues:
You are cordially invited to contribute to the following symposium at SES 2016. Please note the deadline of 6/15/2016. Many thanks!
http://ses2016.org/symposium-c-1-bio-adhesive-contacts-and-biomimetics-…
Symposium C1: Bio-Adhesive Contacts and Biomimetics with Extreme Properties
We would like to invite you to submit an abstract to the symposium F-3: Wave Phenomena in Linear and Nonlinear Metamaterials at the SES 53rd Annual Technical Meeting (SES2016) to be held October 2-5 2016 in College Park, MD.
Symposium Technical Description
