Amit Acharya and Kaushik Dayal

 (To appear in Quarterly of Applied Mathematics)

This paper presents a generalization of traditional continuum approaches to liquid crystals and

liquid crystal elastomers to allow for dynamically evolving line defect distributions. In analogy with

recent mesoscale models of dislocations, we introduce fields that represent defects in orientational

and positional order through the incompatibility of the director and deformation ‘gradient’ fields.

Hi

I have a problem with the simulation of Mohr Coulomb problem. I want to set the properties of a sand. I use the experimental data from papers and i try to find the bearing capacity for a footing on sand. I set density ρ, E modulus of elasticity , ν Poissoin's ratio and for the Mohr Coulomb model i set φ shear strength, ψ dilatancy , c cohesion (a very small value=0.00001 ) for strain 0 . Does it need anything else? Does it need for hardening parameters any diagram for cohesion -plastic strain for the Mohr Coulomb model? 

These notes belong to a course on fracture mechanics

Following Griffith (1921), we distinguish two processes: deformation in the body and separation of the body. Up to this point, the process of deformation has been described by field theories of various kinds, such as

Dear All,

             There is an excellent tool called Mendeley that can be freely downloaded from (www.mendeley.com). It helps you in organizing the literature collection and  in optimizing the literature review process.

Thanks and Regards,

Naga Sai Rohith

Hi everybody,

I am dealing with a beam with a hole containing a crack loaded at the mid-span. I am wondering if the stress intensity factors

(KI, KII) closed form solution have been expanded for this case or not? I would appreciate if anybody could hlep me about this

case.

Thank you,

Parisa

A review paper on stretchable electronics written by Professors John A. Rogers, Takao Someya, and Yonggang Huang was published in a recent issue of Science . This paper gives a nice summary on the recent advances in inorganic and organic stretchable electronics. Materials, structures and mechanics of these systems are discussed. Many attractive applications of stretchable electronics are introduced, such as stretchable silicon circuit, electronic eyeball camera, and flexible LED display. 

The Society of the Engineering Science is sponsoring the 47th Annual Technical Meeting (SES2010) on October 4-6, 2010 at Iowa State University in Ames, IA. The meeting is held on biannual basis as a standalone meeting to foster and promote the exchange of ideas and information among the various disciplines of engineering and the fields of physics, chemistry, mathematics, bioengineering and related scientific and engineering fields.

Elsevier is pleased to announce that details of the oral programme for the 8th Fatigue Damage of Structural Materials conference are now available - please visit www.fatiguedamage.elsevier.com for more information. Invited speakers will include: