A new website has been recently created for the centennial of Professor Raymond Mindlin. In addition, the Engineering Mechanics Division of ASCE has launched an effort to establish the Mindlin Medal of Applied Mechanics. The goal is to raise about $30,000 to setup an endowment at ASCE.
Teng Li, Zhenyu Huang, Zhichen Xi, Stephanie P. Lacour, Sigurd Wagner, Zhigang Suo, Mechanics of Materials, 37, 261-273 (2005).
Under tension, a freestanding thin metal film usually ruptures at a smaller strain than its bulk counterpart. Often this apparent brittleness does not result from cleavage, but from strain localization, such as necking. By volume conservation, necking causes local elongation. This elongation is much smaller than the film length, and adds little to the overall strain. The film ruptures when the overall strain just exceeds the necking initiation strain, εN , which for a weakly hardening film is not far beyond its elastic limit. Now consider a weakly hardening metal film on a steeply hardening polymer substrate. If the metal film is fully bonded to the polymer substrate, the substrate suppresses large local elongation in the film, so that the metal film may deform uniformly far beyond εN. If the metal film debonds from the substrate, however, the film becomes freestanding and ruptures at a smaller strain than the fully bonded film; the polymer substrate remains intact. We study strain delocalization in the metal film on the polymer substrate by analyzing incipient and large-amplitude nonuniform deformation, as well as debond-assisted necking. The theoretical considerations call for further experiments to clarify the rupture behavior of the metal-on-polymer laminates.
Related posts and discussions
Tension of Cu film on Pi substrate
Local thinning of Cu film
High ductility of a metal film adherent on a polymer substrate
In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates, and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks, and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture.
Using the Griffith energy method for analysis of cavitation under hydrostatic tension we conclude that the critical tension tends to infinity when the cavity radius approaches zero (IJSS, 2006, doi: 10.1016/j.ijsolstr.2006.12.022). The conclusion is physically meaningless, of course. Moreover, if we assume that the failure process occurs at the edge of the cavity then the critical tension should be length-independent for small but finite cavities while the Griffith analysis always exhibits length-dependence. The main Griffith idea - introduction of the surface energy - is controversial because it sets up the characteristic length, say, surface energy over volume energy. By no means is this approach in peace with the length-independent classical continuum mechanics.
I had posted this on the amd blog...I am posting it here as well:
Based on a survey from Journal Citation Report (JCR), we listed below the 2004 Journal Impact Factors (IF) for some mechanics, material science, and solid state physics related scientific journals. Our list and information may not be complete. We welcome readers' input, comments, and information. We also caution readers that using IF as the sole criterion to rank scientific journals' academic reputation may not be objective nor true to a journal's actual scientific merits.
The Air Force Office of Scientific Research (AFOSR) of the U.S. Air Force Research Laboratory (AFRL) and National Science Council (NSC) in Taiwan are pleased to announce that the 4th U.S. Air Force/Taiwan Nanoscience and Nanotechnology workshop will be held on February 8-9, 2007 at the main campus of the University of Houston. We invite you to join us at the workshop.
