Soud Choudhury's blog

Hi, we are looking for a Summer Intern at the Chandler Site of Intel Corporation. Please, see below the information and contact me if you are a great fit.

Thank you - Soud

Package FA intern

Responsibilities include but are not be limited to:

- EBSD statistical analysis on Cu and solder grain structures and orientation textures;

- Metallography sample preparation for SEM/EBSD observations;

- Work with Physical Failure Analysis teams on electronic packaging failure mechanisms;

Hi all,

I am modeling a simple coupled temp-displecment analysis with the following step information:

** MATERIALS

** 

*Material, name=Material-1

*Conductivity

 1e-06,

*Creep, law=HYPERB

44000., 0.005,   4.2, 45000., 8.314

*Elastic

60000., 0.34

*Expansion, zero=25.

 1.4e-05,

*Plastic

20.,  0.

60., 0.1

** 

** PHYSICAL CONSTANTS

** 

*Physical Constants, absolute zero=-273., universal gas=8.314

** STEP: Step-1

We usually use Microsoft visual studio's version to do Fortran/C/C++ coding. Many reserachers are facing problem with versions, appropriate compiler or even with copyright issue. "Eclipse" can replace VS in everyway. The advantages are:

Hello Everyone,

I am a new member of imechanica. I have started to learn UMAT of Abaqus to model my material behavior ( Cu6Sn5, HCP) using crystal plasticity finite element model. I found Dr. Huang's single crystal UMAT to start learning UMAT and I thought that it would be a great guide to start though it is written for FCC mat. But unfortunately I was not able to run the UMAT with it's input file.