conference

The 55th Meeting of the Society for Natural Philosophy: Microstructure, defects, and growth in mechanics will be from September 13-15, 2019 at Loyola University Chicago.

http://webpages.math.luc.edu/55SNP.html

A very limited number of openings to give Roundtable (25 min) talks are available. Special consideration will be given to young researchers. Two nights of lodging will be funded for these speakers. If you are interested in giving a Roundtable talk, you must submit an abstract.

Dear colleagues:

We would like to invite you to submit an abstract to the topic on Mechanics Modeling of Soft Robots at the 2019 ASME International Mechanical Engineering Congress & Exposition (IMECE 2019) to be held from November 8-14, 2019 at Salt Lake City, Utah.

Dear colleagues:

We would like to invite you to submit an abstract to the topic on Mechanics and Manufacturing of Soft Materials and Soft Robots at the 2019 ASME International Mechanical Engineering Congress & Exposition (IMECE 2019) to be held from November 8-14, 2019 at Salt Lake City, Utah.

Submit your abstract for the 2019 Society of Engineering Science meeting on the campus of Washington University in St. Louis (WashU), October 13-15, 2019, deadline April 30, 2019 Information about tracks and symposia: https://ses2019.wustl.edu/track-symposia/ 

Submit your abstract: https://ses2019.wustl.edu/track-symposia/abstracts/ 

Dear all,

I bring your attention to the following workshop that will be held in Rome on November 18-20, 2019.

Attendance of the workshop is free. All the relevant information are available in the attached flyer.

Workshop RAM3, Recent Advances in Mechanics and Mathematics of Materials — 2nd International Meeting of Young Researchers

Abstract submission for the Society of Engineering Science annual conference is now open:

https://ses2019.wustl.edu/track-symposia/abstracts/

The deadline to submit is April 30th, 2019. Please consider subitting to our symposium on the Mechanics and Physics of Soft Materials. A full description is given below.

Colleagues:

The technical meeting of the Society of Engineering Science (SES) will be held at Washington University in St. Louis on October 13-15, 2019. As part of this meeting we are organizing Symposium 7.4 on “Mechanics of Electrochemically Active Materials”. The deadline for abstract submission is April 30