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Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond

Submitted by Rui Huang on
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The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes.

Mechanics of growth and rupture of abdominal aortic aneurysm

Submitted by Konstantin Volokh on

We present a coupled mathematical model of growth and failure of the abdominal aortic aneurysm (AAA). The failure portion of the model is based on the constitutive theory of softening hyperelasticity where the classical hyperelastic law is enhanced with a new constant indicating the maximum energy that an infinitesimal material volume can accumulate without failure. The new constant controls material failure and it can be interpreted as the average energy of molecular bonds from the microstructural standpoint.

Post-buckling and Snap-through Behavior of Inclined Slender Beams

Submitted by J Zhao on

In MEMS fields, a need arises in engineering practice to predict accurately the nonlinear response of slender post-buckling beams, especially the nonlinear transverse stiffness. The bistability of the post-buckling beams is excellent in reducing power consumption of micro-devices or micro-systems. However, the major difficulty in analyzing the post-buckling and snap-through response is the intractability of the geometric nonlinear control equations of large deflection beams.

Does anybody have a simple example Program of bounding surface model, or electronic version of books reports..

Submitted by yannyin on

Hi, everyone

I just start my research on bounding surface model for soil mechanics. Does someone have documents about programming of bounding surface model for stress-strain behaviour with a piece of program? Thanks a lot for your help.