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Critical length scale controls adhesive wear mechanisms

Submitted by Ramin Aghababaei on

The adhesive wear process remains one of the least understood areas of mechanics. While it has long been established that adhesive wear is a direct result of contacting surface
asperities, an agreed upon understanding of how contacting asperities lead to wear debris particle has remained elusive. This has restricted adhesive wear prediction to empirical
models with limited transferability. Here we show that discrepant observations and predictions of two distinct adhesive wear mechanisms can be reconciled into a unified

Electrical properties and piezoresistive evaluation of polyurethane-based composites with carbon nano-materials

Submitted by Hamid Souri on
research
Expanded graphite; Graphite nanoplatelet; Three-roll milling process; Electrical characteristics; Piezoresistivity; Polyurethane; Composite

The present study assesses the applicability of carbon materials-embedded polyurethane (PU) composites characterized by high piezoresistive capability, as a traffic loading sensor. PU composites incorporating multi-wall carbon nanotubes (MWNTs), expanded graphite (EG), and a hybrid of MWNTs and graphite nanoplatelets (GNPs) were fabricated and their electrical conductivities were measured in an effort to determine the most suitable filler type for the piezoresistive sensor and its optimum content ratio.

A facile method for transparent carbon nanosheets heater based on polyimide

Submitted by Hamid Souri on
research
Thin film heater; Polyimide; Transparent

In this work, a novel film heater in nanometer-scale thickness based on catalyst-free and transfer-free carbon nanosheets (CNSs) with properties similar to graphene is fabricated. Here, poly(amic acid) (PAA), which is composed of several aromatic hydrocarbon rings, is used as the carbon precursor of CNS films. Altering the polymer concentration easily controls the morphological, optical, and electrical properties of the CNS films obtained by carbonization of PAA thin films.

Call for Abstracts: SES2016 Symposium D-6: Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures

Submitted by Gi-Dong Sim on
conference
SES2016
UMD

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center. 

We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”

Call For Abstracts: 2016 SES Symposium D-11: "Instability and Interfacial Adhesions in Bio-Compatible Electronics"

Submitted by ShuodaoWang on
conference

Dear Colleagues,

Please consider submitting abstract(s) to Symposium D-11 "Instability and Interfacial Adhesions in Bio-Compatible Electronics" at the 2016 SES meeting to be held at the University of Maryland-College Park During October 2-5, 2016.  Abstract due: June 15, 2016.

Call for Abstract Submission to SES2016 Symposium E-3: Advanced Nano-Manufacturing for Multi-functional Nanosystems

Submitted by hongli on
conference

Dear Colleagues,

You are warmly invited to submit your one-page abstract to our Symposium E-3: Advanced Nano-Manufacturing for Multi-functional Nanosystems for the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016)  

Deadline for submission of Abstracts is June 15, 2016. 

Co-organizers:

Call for Abstracts: SES2016 Symposium D-13: Architectured Meta-materials: Engineering Science, Design, Manufacturing and Characterization

Submitted by Francois Barthelat on
conference
SES 2016

The 53rd Annual Technical Meeting of the Society of Engineering Science will be held at the University of Maryland (UMD), 2-5 October 2016. We are organizing a symposium on Architectured Metamaterials which will cover research on the structure, mechanics, design, optimization, fabrication and mechanical performance of all categories of architectured materials including but not limited to lattice materials, metamaterials, topologically interlocked materials and bio-inspired materials. We expect that the SES meeting and this symposium will offer a great platfor

CALL FOR ABSTRACT: SES Symposium C-4: Mechanical Characterization of Soft Materials: Experiments and Modeling

Submitted by Cai Shengqiang on
conference
SES2016

Soft materials are ubiquitous in nature, from biopolymers, cells, and tissues to organs. In recent years, soft materials have been intensively explored in different engineering applications, ranging from haptic devices to soft robotics, from flexible electronics to biomimetic systems. Fundamental studies of the deformation mechanisms of soft materials and optimal designs in different applications urgently need robust methods for material characterization.

Postdoctoral opening in topology optimization at UC San Diego

Submitted by alicia on
job
Topology optimization
thermal mechanics
Level set method
Multiphysics

Applications are sought for one Post-Doctoral Researcher at University of California, San Diego (USA) to join the M2DO research lab. The primary research focus is to develop topology optimization for multiscale and multiphysics problems optimizing materials and structures.

Relevant research background in the following areas are encouraged to apply:

[Call for Abstracts] SES minisymposium on Friction, Fracture, and Damage

Submitted by Ahmed Elbanna on
conference
SES2016

Dear Colleagues,

We would like to invite you to consider submitting abstracts to the following minisymposium taking place as part of the Soceity of Engineering Sciences meeting to be hosted by the University of Maryland (October 2-5, 2016)

D-9 :Friction, Fracture and damage (http://ses2016.org/symposium-d-9-friction-fracture-and-damage/)

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