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Three-dimensional simulation of crack propagation in ferroelectric polycrystals: Effect of combined toughening mechanisms

Submitted by Amir Abdollahi on

We simulate the fracture processes of ferroelectric polycrystals in
three dimensions using a phase-field model. In this model, the grain
boundaries, cracks and ferroelectric domain walls are represented in a
diffuse way by three phase-fields. We thereby avoid the difficulty of
tracking the interfaces in three dimensions. The resulting model can
capture complex interactions between the crack and the polycrystalline
and ferroelectric domain  microstructures. The simulation results show
the effect of the microstructures on the fracture response of the
material. Crack deflection, crack bridging, crack branching and
ferroelastic domain switching are observed to act as the main fracture
toughening mechanisms in ferroelectric polycrystals. Our fully 3-D

determine mode shape in ansys

Submitted by engmohsen on
how can i determine mode shape for 3 first mode in below code?

COM,ANSYS MEDIA REL. 140 (11/26/2011) REF. VERIF. MANUAL: REL. 140

/VERIFY,VM59

/PREP7

MP,PRXY,,0.3

/TITLE, VM59, LATERAL VIBRATION OF AN AXIALLY LOADED BAR

C***          VIBRATION PROBS. IN ENGR., TIMOSHENKO, 3RD. ED., PAGE 374, ART. 59

ANTYPE,STATIC                ! STATIC ANALYSIS

Instability of supersonic crack in graphene

Submitted by beenchang on

The velocity and instability of crack motion in 2D hexagonal lattice of graphene under pure opening loads

are investigated by atomistic molecular dynamics simulations. The brittle crack along zigzag direction

in a strip can propagate supersonically at even 8.82 km/s under uniform normal loading of edge

displacements. Crack moving straightly at low speeds produces atomically smooth edges, while kinking

occur beyond a critical speed around 8.20 km/s equivalent to 65% of Rayleigh-wave speed in graphene,

Debonding simulation - XFEM fracture criterion - delamination

Submitted by davidrbmelo on
Hello

I am using Abaqus/CAE 6.10 to simulate a Debonding test (cohesive behavior for composite delamination). 
I ran a Abaqus debonding simulation example (from Abaqus online documentation - Abaqus Benchmark Manual - 2.7.1 Delamination analysis of laminated composites).

The Abaqus/Explicit three-dimensional model with surface-based traction-separation behavior used a surface contact interaction property with:
- default Cohesive behavior

Wafer Butterfly Valve

Submitted by Anonymous (not verified) on

Wafer Butterfly Valve

 

Wafer Butterfly Valve Specification: DN50-600

Wafer Butterfly Valve Temperature: -15°C~120°C

Wafer Butterfly Valve Pressure: 1.0MPa/1.6MPa

Wafer Butterfly Valve Materials of Body: Ductile Iron (GGG40,GGG50).Cast Iron (GG25),Stainless Steel 

Wafer Butterfly Valve Materials of Disc: Stainless Steel, Nickel Plated Ductile Iron, Ductile Iron Coated Plastic