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The submersion of a polymer network with a high density of hydrogen bond based cross-links in an aqueous bath results in the formation of a rubber-like hydrogel. The cross-links, which connect chains and maintain the structure of the network, can dissociate as a result of two main factors: (1) the interactions between the hydrogen bonds and the surrounding water molecules and (2) the forces that are exerted on the cross-link from the interconnected chains.

EML Webinar (Season 2) on 16 December 2021 will be given by Nanshu Luonsoft electronics for digitizing human body and human-centered robotics. Discussion leader: John A. Rogers, Northwestern University

Time: 9:30 am Boston, 2:30 pm London, 10:30 pm Beijing on 16 December 2021

Zoom Link: https://ter.ps/EMLWebinarS2

Dear Colleagues,

We would like to draw your attention to the following mini-symposium at the upcoming WCCM-APCOM Conference to be held in Yokohama, July 31st-Aug 5th, 2022:

0603: Modelling and simulation of coupled solvent transport and deformation

It appears in the Fluid Dynamics and Transport Phenomena section, but it is very much a solid mechanics-oriented mini-symposium!

The (already extended) deadline for abstract submission is January 9.

Peel strength, the average force required to separate two bonded materials from one another, is a property applicable to various industries including aerospace, automotive, adhesives, packaging, biomaterials, microelectronics, and more. Peel test data is used to determine the quality of the adhesive joint and, where applicable, provides information on the effects of processes and of the environment on the adhesive-adherend interface strength.

Postdoc Open Positions

Postdoc positions with financial support (up to 3 years) are immediately available in the Department of Mechanical Engineering, University of Connecticut (UConn).

Required Degree:

Ph.D. in Engineering Mechanics, Chemical, Mechanical, or Civil Engineering, Material Science, Condense Matter Physics, or Computational Chemistry.

Required Skills:

Please see the attached announcement. We are going to accept applications till December 31st 2021. Send emails to amsgroup [at] beckman.illinois.edu