CAD Tools for Co-simulation and Modelling of MEMS Devices, Associated Electronics and Packaging-Part Two
Webinar
Date: April 24, 2012; Time: 12:00 - 1:00 pm (EDT)
Webinar
Date: April 24, 2012; Time: 12:00 - 1:00 pm (EDT)
IntelliSuite was the first MEMS-specific CAD tool and has been under
development for over 20 years. In this free webinar, understand how this
industry-standard software can help MEMS designers, process engineers,
and professors save time and costs in the development cycle, share their
designs with others, and teach students about MEMS. The webinar will
cover: process development using virtual fabrication tools, etch recipe
development using process simulators, design rule checking and
cross-sectioning tools for MEMS layout, design exploration and
optimization using behavioral and parametric modeling, recent
developments in automated meshing algorithms, discussion of coupled
FEM-BEM solvers for MEMS multiphysics analysis, linking MEMS models to
Dear Colleagues:
We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX. The symposium is entitled Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS and is part of the Micro- and Nano- Systems Engineering and Packaging Track.
The call-for-papers for the symposium is as follows:
Dear Colleagues:
We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX. The symposium is entitled Tribology of Thin Films and Small-Scale Structures and is part of the Mechanics of Solids, Structures and Fluids Track.
I am looking for a postdoctoral position. I have expeience in finite element modeling and laboratory measurements of ultrasonic waves in ferroelectric and piezoelectric plates, piezoelectric transducers and actuators, MEMs. Also worked in the field of computational electromagnetics. Please look at the attached resume.
Dear Colleagues,
I would like to bring your attention to the contest on "Modeling and Simulation of Nano/Microsystems" at the University of Michigan. This is an international competition.
The objective of this contest is to provide publicity and
promotional support to new developments, recent progress, and advances
in the modeling and simulation of Micro/Nanosystems. The emphasis is on
current challenges in understanding of the multi-physics/multi-scale
phenomena that govern such systems functionality.
Welcome to the January 2010 issue! In the issue of May 2007 , Prof. Xiaodong Li outlined the existing experimental methods for mechanical characterization of 1D nanostructures. In this issue, I will discuss along the same line but focus on experimental methods enabled by microelectromechanical systems (MEMS).