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NANOVEA's picture

Shot Peen Hardness With Nanoindentation

The intention of shot peening is ultimately to alter the mechanical properties of a given surface. By hitting the surface with controlled shot the surface will deform plastically. Proper Instrumentation, nanoindentation, will play a vital factor in achieving reliable and intended results.

NANOVEA's picture

Viscoelastic Analysis With Nanoindentation DMA

Viscoelasticity can be studied using Dynamic Mechanical Analysis (DMA) during Nanoindentation. By applying controlled oscillatory stress the resulting strain can easily be measured. An elastic material will have stress and strain in phase while a viscous-elastic material will have strain lagging stress. In many applications during quality control and R&D, it is important to reliably test this behavior.

Fellowships and Ph.D. position available: Analysis and modeling of the mechanical behavior of 3D nanoparticles superstructures

Colloidal nanocrystals (NCs) form a family of highly advanced building blocks suitable for large scale assembly of novel high-complexity 1D-to-3D superstructures. Their properties and inter-particle interactions, nowadays, can be highly controlled by tailoring their size, shape, composition and surface functionalization.

Hardness value from Nanoindentation Curve


Is there anyone aware of the reason why there is a surge in hardness value during the initial stages of penetration in nanoindentation curve. In a plot of hardness vs displacement into surface, I record a high value during the initial stages of the run. I am little confused about the reason.



NANOVEA's picture

Nanoindentation Fracture Toughness

The ability of a material to resist cracking, or fracture, has been vital to the studies of fracture mechanics. Until recently the study of fracture toughness has been analyzed at a macro range using powerful instrumentation applied to large samples.

NANOVEA's picture

Nanoindentation Creep Measurement

Creep can be characterized as the result of a solid material that is slowly and permanently deformed under the influence of stress. Deformation results from the consistent stress below the yield strength of the material. The amount of applied stress and its duration can eventually lead to the failure of the given material. Ultimately, it is for this reason that Nanoindentation creep measurement provides crucial information to study material behavior.

Richard R. Chromik's picture

Opening - Ph.D. students in Materials Engineering

I am currently accepting applications for two Ph.D. students starting in January 2012. The students will join my research group in the Materials Engineering department at McGill University. Students in my research group are trained to be world class researchers in the fields of surface engineering and coatings tribology.

NANOVEA's picture

Cyclical Nanoindentation Stress-Strain Measurement

The Stress-Strain curve obtained by Nanoindentation reveals the correlation of "Stress" and"Strain" of a given material under nano controlled loads. Unlike the traditional Tensile Testing method of obtaining Stress-Strain curve data, which gives data at a macro level, the Nanoindentation method provides vital Stress-Strain curve data at nano level scale without the large and intense machinery. The Stress-Strain curve of various materials will vary widely.

grahamcross's picture

Nanoscale Polymer Mechanics - Postdoctoral Position, Trinity College Dublin

Postdoctoral Fellowship at the CRANN Nanotechnology Institute, Dublin, Ireland - Available immediately:  A postdoctoral position in the area of nanoscale polymer mechanics for mechanical nanostructure forming and nanoimprint of soft condensed matter and glass forming systems.


Acurate Size Measurements of Nano Particles and Nano Pores Make Mechanical Understanding Easy

Encouraged by its current and prospective customers, Ebatco’s Nano Analysis and Testing Laboratory (NAT Lab) has expanded its nano/micro scale analytical and measurement capabilities significantly. More than ever before, customers can gain insights and comprehension of what is going on and why it has happened at the nano/micro scale.

NANOVEA's picture

Nanoindentation of Silicon Carbide Wafer Coatings

The fabrication process for microelectronic devices can have over 300 different processing steps and can take anywhere from six to eight weeks. During this process the wafer substrate must be able to withstand the extreme conditions of manufacturing, since a failure at any step would result in the loss of time and money. The hardness and strength of a wafer must be much greater then the conditions imposed during manufacturing to insure a failure will not occur.

Li Han's picture

New methods of analyzing indentation experiments on very thin films

Abstract - Indentation experiments on very thin films are analyzed by employing a rigorous solution to model elastic substrate effects. Two cases are discussed: elastic indentations where film and substrate are anisotropic, and elasto-plastic indentations where significant material pile-up occurs. We demonstrate that the elastic modulus of a thin film can be accurately measured in both cases, even if there is significant elastic mismatch between film and substrate. 

This manuscript has been accepted for publication in Journal of Materials Research.  

Help needed with interpretation of received P h curves during NANOINDENTATION

Dear iMechanicas,


I just started doing nanoindentation tests on dry biological samples (wood) with a flat punch tip and I have problems analyzing the results! I would be happy if anybody could give me some suggestions.

While running a test I receive quiet good force-displacement curves (no adhesion, good surface find, no time-depend behavior) but the values for the recieved elastic modulus are not stable! The value scatters over the whole range of displacement.

grahamcross's picture

Trinity College (CRANN) Ph.D. Fellowship: Physics of Nanostructure Forming

4 year Postgraduate Fellowship in the School of Physics and the CRANN Nanoscience Institute,Trinity College, Dublin, Ireland

Nanomechanics Group of Dr. Graham Cross (webpage)

Available immediately:  A doctoral fellowship in soft condensed matter physics, with an emphasis on large strain nanoscale deformation and controlled pattern production.

aminor's picture

Workshop on Probing the Limits of Strength, August 10-12, 2009 at LBL, Berkeley, CA

Dear Colleague:
You are cordially invited to attend a special Workshop on Probing the Limits of Strength, which will be held at Lawrence Berkeley National Laboratory on August 10-12, 2009. This workshop aims to bring together researchers with an interest in experimental and theoretical studies of the fundamental limits of strength in materials. The workshop will include a strong lineup of national and international speakers on advanced mechanical testing techniques and computational materials science of materials deformation at the elastic limit.

ChristineOrtiz's picture

PostDoc Position Available at MIT

PostDoc Position Available

Ortiz Laboratory at MIT

Professor Christine Ortiz, Department of Materials Science and Engineering , Massachusetts Institute of Technology, Cambridge, MA, USA

To apply for this position; send cover letter including date available to start, CV, full list of publications, and the names of three references to:


kashoo's picture

Load-displacement curves

I am trying to simualet Indentation Hardness Testing in ABAQUS and feeling like that there is some problem in my model.

Whenever I try to plot load-displacement curves it gives me bumps in the curve. Any idea, what should I do?

Should I reduce mesh size, I have done but then it gives me error with step size and so on.,

Li Han's picture

Determining the elastic modulus and hardness of an ultra-thin film on a substrate using nanoindentation

Abstract – A data analysis procedure has been developed to estimate the contact area in an elasto-plastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu’s elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials.


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