Expanding molecular understanding of large deformation in Thermoplastic Polyurethanes
Shuze Zhu, Nikolaos Lempesis, Pieter J. in ‘t Veld, and Gregory C. Rutledge
Macromolecules, in press, 2018, https://pubs.acs.org/doi/10.1021/acs.macromol.8b01922
Shuze Zhu, Nikolaos Lempesis, Pieter J. in ‘t Veld, and Gregory C. Rutledge
Macromolecules, in press, 2018, https://pubs.acs.org/doi/10.1021/acs.macromol.8b01922
One or two fully funded PhD positisons (tuition plus reasearch or teaching assistantships) are immediately available in the Computational Dynamics and Materials Laboratory at North Dakota State University (NDSU) during the academic year 2018~2019. Our research aims to advance the design and development of high-performance multifunctional engineering materials (including polymers, composites, granular/soft matter and biomaterials) through computation, multiscale modeling and machine learning.
Shuze Zhu, Nikolaos Lempesis, Pieter J. in ‘t Veld, and Gregory C. Rutledge, Macromolecules, Articles ASAP, 2018. https://pubs.acs.org/doi/10.1021/acs.macromol.7b02367
Dear Colleagues,
We would like to invite you to submit an abstract to our symposium titled “362 Failure and Damage in Soft Materials: From Instabilies to Cracking” as part of the 18th U.S. National Congress for Theoretical and Applied Mechanics (Northwestern University in Chicago, IL, June 4-9, 2018).
The deadline for abstract submission is November 10, 2017.
Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations
The Material and Process Simulation group at the University of Bayreuth is offering a
1 Post-Doc Position TV-L E13 (m/f)
Colloids in polymer systems: Numerical studies and simulations
Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations
The Material and Process Simulation group at the University of Bayreuth is offering a
1 Post-Doc Position TV-L E13 (m/f)
Colloids in polymer systems: Numerical studies and simulations
Description
The selected individual will lead the development, initial application and deployment of new modeling capability in the area of thermoplastic packages. The initial focus is on developing best in class material models across a range of polymers. This material modeling capability will be leveraged globally for a broad range of packaging model applications (blow molding, parison / preform optimization, empty and full bottle interaction with packing lines, etc.)
Ying Li , Brendan C. Abberton , Martin Kröger and Wing Kam Liu
Journal of Microelectromechanical Systems
Ping Du; Chen Cheng; Hongbing Lu; Xin Zhang
Volume: 22, Issue: 1, Page(s): 44 - 53
DOI: 10.1109/JMEMS.2012.2213070