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PhD positions in multiscale modeling of materials at North Dakota State University

Submitted by Wenjie Xia on

One or two fully funded PhD positisons (tuition plus reasearch or teaching assistantships) are immediately available in the Computational Dynamics and Materials Laboratory at North Dakota State University (NDSU) during the academic year 2018~2019. Our research aims to advance the design and development of high-performance multifunctional engineering materials (including polymers, composites, granular/soft matter and biomaterials) through computation, multiscale modeling and machine learning.

 

USNC/TAM 2018 mini-symposium 362: Failure and Damage in Soft Materials: From Instabilies to Cracking

Submitted by Yunwei Mao on

Dear Colleagues,

We would like to invite you to submit an abstract to our symposium titled “362 Failure and Damage in Soft Materials: From Instabilies to Cracking” as part of the 18th U.S. National Congress for Theoretical and Applied Mechanics (Northwestern University in Chicago, IL, June 4-9, 2018).

The deadline for abstract submission is November 10, 2017.

Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations

Submitted by ajmal.choudhary on

Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations

 

The Material and Process Simulation group at the University of Bayreuth is offering a

1 Post-Doc Position TV-L E13 (m/f)

Colloids in polymer systems: Numerical studies and simulations

 

Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations

Submitted by ajmal.choudhary on

Post-Doc Position: Colloids in polymer systems: Numerical studies and simulations

 

The Material and Process Simulation group at the University of Bayreuth is offering a

1 Post-Doc Position TV-L E13 (m/f)

Colloids in polymer systems: Numerical studies and simulations

 

Polymer Packaging Modeling Engineer at Procter & Gamble

Submitted by Jim Shepherd on

Description

The selected individual will lead the development, initial application and deployment of new modeling capability in the area of thermoplastic packages. The initial focus is on developing best in class material models across a range of polymers. This material modeling capability will be leveraged globally for a broad range of packaging model applications (blow molding, parison / preform optimization, empty and full bottle interaction with packing lines, etc.)